Tuesday, December 15, 2009

Intersil to Acquire Rock Semiconductor

MILPITAS, CA and SHANGHAI, CHINA--(Marketwire - December 15, 2009) - Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high-performance analog and mixed-signal semiconductors, today announced that it has signed a definitive agreement to acquire Rock Semiconductor, a privately-held, fabless semiconductor company with technology leadership in highly integrated power management ICs.
Rock Semiconductor provides high-performance analog and mixed-signal integrated circuits for wireless, audio, video and data communications solutions. Rock's products are primarily used in the consumer end market in applications such as cellular phones, personal navigation devices, portable multimedia players and other types of popular consumer electronics products.

"Rock Semiconductor's products are a perfect fit with Intersil's rapidly expanding portfolio of power management, audio and communications ICs," said Dave Bell, Intersil's CEO. "In addition, the acquisition of Rock will immediately give Intersil a greatly expanded presence in the burgeoning local Chinese market."

"We are delighted to join the Intersil team," said Ye Song, General Manager, Rock Semiconductor. "Having access to Intersil's global network of engineering, manufacturing and marketing resources will accelerate our time-to-market for new products and enable the combined companies to penetrate new markets even faster."

Rock has design centers in Shanghai and Wuhan, China. "Intersil is committed to expanding its business through both organic growth and strategic acquisitions," said Dave Bell. "Rock's team of highly experienced analog and mixed-signal design engineers will immediately increase our design capability and ability to serve hundreds of Chinese and global customers."

Thursday, December 10, 2009

RedMere Closes US$5.6m Funding Round

Dublin, Ireland – December 10th 2009 – RedMere, the leading supplier of smart active cable solutions, has secured US$5.6 million in Series “B” funding which was led by Celtic House Venture Partners, Toronto. The round follows major design wins for the company’s products in US and European markets for HDMI smart cables.

EdgeStone Capital Partners (Toronto) and Enterprise Equity (Dublin) also participated in this funding round.

“Our EyeWire active chipset has now been adopted in Home Theatre and Camera cable applications worldwide. The thin nature of the cables makes them easy to route and hide, and their reduced weight makes them ideal for portability. This funding round will be used primarily to expand our penetration into the camera and mobile handset (Smartphone) markets”, commented Peter Smyth, CEO RedMere. “These cables are ultra thin, about 2mm in diameter, perfect for carrying with these portable applications”.

RedMere’s EyeWire chip technology removes up to 80% of the copper used in hi-definition video cables by placing a self-powered chip in cables. The chip embeds signal processing technology directly into the cable structure to improve bandwidth performance and guarantees support for all HDMI data rates including the latest HDMI V1.4.

About RedMere
In a world where connection speed increases, RedMere enables easy to use, high quality, smart connectivity for The Home, On the Move and The Office. These new active cable systems deliver the ultimate in compact digital connectivity over HDMI, DisplayPort and USB for Video and Still Cameras, Smartphones, HDTV, Blu-Ray DVD, PS3 and Xbox, as well as enterprise solutions using Infiniband and PCI Express. RedMere provides cable-embedded semiconductors and advanced cable reference designs to cable industry leaders and manufacturing partners. RedMere is a private company with lead investors Celtic House Venture Partners and EdgeStone Capital Partners.

Monday, December 7, 2009

Arteris Raises $9.7M as Qualcomm and ARM Join Existing Investors

SAN JOSE, Calif.--(BUSINESS WIRE)--Arteris Inc., a leading interconnect IP solutions provider, announced today that it has raised the first tranche of a strategic investment round totaling $9.7 million from a group of investors led by Qualcomm Incorporated and including ARM. These two new investors join existing investors, Synopsys, DoCoMo Capital, Crescendo Ventures, TVM Capital and Ventech, who also participated in this round. Arteris is the pioneer of Network on Chip (NoC) interconnect IP solutions and supplies its technology to leading SoC makers for wide range of applications. Arteris will use the financing to expand its global sales and customer support infrastructure to further accelerate adoption of its Interconnect IP and design tool solutions.

“We see the Network on Chip technology as an enabling technology in designing complex SoCs at 40 nanometer processes and beyond,” said Frederic Rombaut, Managing Director, Qualcomm Ventures Europe. “As process technology advances and individual integrated circuits become more complex, there needs to be a new approach to integrating and managing all the functionality on a single chip.”

“This investment is central to our strategy of creating a heterogeneous interconnect eco-system around the AMBA® specification, upon which our mutual customers can design and connect a variety of innovative IP, complementary protocols and services,” said Keith Clarke, General Manager, Fabric IP, ARM. “We will work with Arteris to ensure that ARM® silicon partners have access to the broadest range of AMBA and multi-standard interconnect solutions. Our goal is to have the Arteris technology interoperate with AMBA protocol-based IP and so accelerate deployment of ARM processors in SoC designs.”

“The addition of Qualcomm and ARM to the group of investors who are backing Arteris is another endorsement of our interconnect technology approach, and will bring more semiconductor industry expertise to our team. We have demonstrated, by SoC tapeouts, production silicon and delivery of Arteris connected end products to consumers, that the Arteris NoC technology improves complex SoC design quality while reducing design cycle time compared to existing hybrid bus interconnect approaches. We are aiming to deepen the interoperability of the Arteris NoC technology with ARM processors, and AMBA interconnect protocol standards to help SoC makers and system houses improve capability and delivery of advanced SoC semiconductors,” said K. Charles Janac, President and CEO of Arteris.

About Arteris

Arteris, Inc. provides semiconductor interconnect IP, and tools to improve communication performance of ICs for wide range of applications. Results obtained by using Arteris IP product line include lower power, higher performance, lower risk of development and faster delivery of simple to complex ICs, SoCs and FPGAs.

Founded by networking experts, Arteris operates globally with headquarters in San Jose, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, , and Ventech. More information can be found at http://www.arteris.com.

Thursday, December 3, 2009

SiTune Corporation Secures Series B Financing with Greenlane Investments LLC

SAN JOSE, Calif.--(BUSINESS WIRE)--SiTune Corporation, a leader in CMOS radio-frequency (RF) and mixed signal solutions for mobile, cable and terrestrial TV, announced that it has secured its Series B financing with current investor Greenlane Investments LLC. SiTune will use the proceeds of the new financing for ramping production of its latest generation of state of the art Mobile Digital TV and Universal CMOS TV tuners based upon its P2TUNE architecture and grow its international sales infrastructure.

“The message from our customers and partners in ASIA pacific and North America validities a strong demand for SiTune’s Multiple Standard RF CMOS TV Tuners,” said Vahid Toosi President and CEO of SiTune Corporations. “In order to address the imminent volume, we are ramping up our production infrastructure and aggressively expanding our International presence to support and expand our customer base.”

“Greenlane is pleased about its investments in SiTune Technology and corresponding Market. SiTune has been the technology leader for high performance, ultra low power and highly integrated CMOS TV Tuners,” said Dr. Sam Heidari, managing partner at Greenlane Investments LLC. “Technology development phase of SiTune has been flawless. We are excited to participate with SiTune as it demonstrates the leadership to rapidly expand the Digital Mobile TV and worldwide CMOS TV Tuner market.”

Wednesday, December 2, 2009

Aquantia Announces $44M Financing

Milpitas, Calif., December 1, 2009 -- Aquantia, the leading developer of mainstream 10GBASE-T PHY solutions, has just completed its Series D financing, bringing $35 million immediately and up to $44 million in time to the company. This fresh injection of capital enables scaling of Aquantia’s product portfolio to fully serve the accelerated transition to 10G Ethernet in Enterprise and Data Center markets.

New Enterprise Associates (NEA) led the round, with participation from Aquantia’s existing investors including Lightspeed Venture Partners, Greylock Partners, Pinnacle Ventures, Venture Tech Alliance. In conjunction with the financing, NEA Partner Rohini Chakravarthy will join the board of directors.

“NEA’s strong presence in the enterprise and infrastructure areas has offered us a privileged view into the 10G Ethernet ecosystem,” said Ms. Chakravarthy. “We are impressed with Aquantia’s team and execution and are very bullish on Aquantia’s prospects for sector leadership.”

Faraj Aalaei, CEO and president of Aquantia, commented, “The size of the round and the addition of NEA as a new investor are an outstanding vote of confidence for both Aquantia and for the industry, especially given the financial market’s dynamics this year. We believe this financing validates our technology leadership, our business plan and sets Aquantia apart from our privately funded competitors. Aquantia is very well-positioned to enable widespread adoption of 10GBASE-T in switches, NIC cards and LAN-on-Motherboard (LOM) in servers.”

“IDC believes that corporations worldwide will accelerate their IT spending in the second half of 2010,” said Shane Rau, Research Director in Computing, Networking, and Storage Semiconductors, IDC. “Due to factors like lower component pricing and the move to virtualization in the data center, 10 Gigabit Ethernet will benefit significantly. Specifically, IDC predicts that the revenue in the emerging NIC/LOM semiconductor segment of the 10GE market will grow at a CAGR over 50% from 2007 through 2012.”

In May 2009 Aquantia announced the validation in 40nm of the world’s first quad 10GBASE-T IC, to deliver the critical power, density and cost performance levels needed by the data center ecosystem. Aquantia’s current and newest generations of 10GBASE-T products have brought together the benefits of high-energy efficiency and high density for LOM and high-density switching implementations.

About Aquantia
With its 10GBASE-T silicon products for mainstream high-speed connectivity, Aquantia meets business needs for efficiency, lower Total Cost of Ownership (TCO), productivity and easy-to-use network infrastructure. The company’s versatile technology platform is based on advanced signal processing, while fully leveraging the maturity of Ethernet and offering the universal appeal of the RJ45. Aquantia ICs connect multi-core data centers, applications-optimized workgroup computing and virtual server networks with one flexible low-cost and standards based architecture. Aquantia is a venture-backed private company. For more information, visit www.aquantia.com.