Tuesday, December 28, 2010

Broadcom Completes Acquisition of Gigle Networks Inc.

IRVINE, Calif., Dec. 28, 2010 /PRNewswire-FirstCall/ -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it has completed the acquisition of Gigle Networks Inc., a privately-held company that develops system-on-a-chip (SoC) solutions for home networking over power lines.


In connection with the acquisition, Broadcom paid approximately $75 million to acquire all of the outstanding shares of capital stock and other rights of Gigle Networks Inc. The purchase price was paid in cash, except that holders of unvested employee stock options will receive Broadcom equity awards. A portion of the cash consideration payable to the stockholders was placed into escrow. Additional consideration was reserved for future payment upon satisfaction of certain performance goals.


Excluding any purchase accounting related adjustments or fair value measurements, Broadcom expects the acquisition of Gigle Networks Inc. to be dilutive by approximately $0.01 per share in 2011.

Wednesday, December 22, 2010

Zarlink invests $5M in Multigig

Zarlink Semiconductor (TSX: ZL) and Multigig, Inc. today announced that Zarlink has invested US$5 million as part of a US$10 million Series C financing in Multigig, a fabless semiconductor company that provides advanced clock generation and timing products for the wired and wireless communications markets. CMEA Capital and Sierra Ventures also participated in the financing.

Multigig will use the financing to invest in the continuing development of its RotaryWave™ timing technology. RotaryWave technology delivers clocks with extremely low jitter for high-speed communication applications.

"There is growing demand for new timing technologies for wired and wireless applications," said Kirk Mandy, President and CEO, Zarlink Semiconductor. "Multigig's timing technologies deliver performance, cost and power advantages across a widening range of telecom, communications, networking, server and storage applications."

"Multigig is pleased to have Zarlink as a strategic investor in our Series C financing," said Michael Canning, President and CEO, Multigig, Inc. "Our current products represent a significant advance in timing technology. However, there is much more that we can achieve with RotaryWave in terms of increased integration and improved performance. This Series C financing will help us reach that goal."

About Zarlink Semiconductor
Zarlink Semiconductor delivers world-leading, mixed-signal chip technologies for a broad range of communication and medical applications. The Company's core capabilities include network timing solutions that manage time-sensitive communication applications over wireless and wired networks, line circuits supporting high-quality voice services over cable and broadband connections, and ultra low-power radios enabling new wireless medical devices and therapies. Serving the world's largest original equipment manufacturers, Zarlink's highly integrated chip solutions help customers simplify design, lower costs and reach market quickly. For more information, visit
www.zarlink.com.

About Multigig, Inc.
Multigig, Inc. is a fabless semiconductor company that provides advanced next generation clock and timing solutions for the wired and wireless communications markets. Over 30 issued patents protect Multigig's proprietary technology. Visit Multigig online at www.multigig.com.

Tuesday, December 14, 2010

Altera Acquires Avalon Microelectronics

SAN JOSE, Calif., Dec. 14, 2010--Altera Corporation (Nasdaq: ALTR) announced today it has acquired Avalon Microelectronics Inc., an industry leader in flexible Optical Transport Network (OTN) IP, for use in its FPGA and ASIC products. With the acquisition of Avalon, Altera expands its portfolio of customizable IP solutions for OTN applications, supporting data rates at 1.2G, 2.5G and 10G, as well as 40G and 100G.

“As FPGAs increasingly replace ASICs and ASSPs in the heart of many systems, Altera is delivering more system-level technologies and solutions to our customers,” said Don Faria, senior vice president, Communication and Broadcast Business Division, at Altera. “Avalon has been a key partner for many years and is the sole IP supplier for the 100G OTN solutions implemented in our FPGAs. With its strong system expertise in transmission applications and detailed FPGA knowledge, Avalon has established itself as a key provider to numerous top-tier communications infrastructure OEMs. We are excited to have Avalon join the Altera family.”

As communications network bandwidth requirements grow exponentially to support video data (which comprises over 90% of consumer traffic), service providers need equipment providing flexible provisioning and seamless upgradeability for next-generation standards, such as 100G and 400G. The optical wavelength-division multiplexing (WDM) equipment market is expected to grow from $6.7B to $10.4B, or 56 percent from 2010 to 2014, with 40G and 100G deployments leading the way(1). Because new optical protocol standards are being developed simultaneously with new equipment design, equipment manufacturers require flexible hardware solutions using FPGAs with future cost-reduction paths such as Altera's HardCopy™ ASICs.

“Our customers require flexible OTN solutions that can operate at very high data rates,” said Wally Haas, Avalon's founder and chief technology officer. “Aligning two companies that are leaders in their respective space just makes a lot of sense, and we could not be more pleased joining Altera. Altera's 28-nm and 40-nm product portfolio demonstrates their leadership in high-performance flexible silicon platforms for the communications market. The integration of our two companies' technologies and expertise will dramatically accelerate our communications customers' time to market with next-generation optical networks, as our combined customizable IP enables our customers' differentiation in their market.”

Terms have not been disclosed on the acquisition, which is not a material financial matter for Altera.

Monday, December 13, 2010

AltoBeam Closed Series C Funding

BEIJING--(BUSINESS WIRE)--AltoBeam, a developer of advanced DTV demodulators, today announced that it has successfully closed a 6 million US dollars round of Series C funding, led by US Venture Partners (USVP). Subsequently, Irwin Federman and David Liddle, partners of USVP and veterans in the semiconductor industry and investment community, joined AltoBeam’s Board of Directors. AltoBeam’s long-term investors, DFJ DragonFund, Tano Capital, and PYJ-Dynasty Venture Fund, also participated in the round.

USVP is a highly regarded Tier-1 Silicon Valley venture capital firm that has helped build great companies for three decades. Its investment portfolio includes industry leaders in a variety of markets, such as Sun Microsystems and AMCC.

AltoBeam’s advanced DTV demodulators have been adopted by a significant majority of global TV makers, and the successful close of the Series C round with USVP and its long-term investors demonstrates that the company has become a major player in CTTB/DTMB DTV semiconductor supply chain and won investors’ confidence.

Thursday, December 2, 2010

Monday, November 29, 2010

Peregrine Semiconductor files for IPO

San Diego based semiconductor manufacturer Peregrine Semicondutor filed their SEC form S-1 in anticipation of an future IPO. As originally reported by Dan Primak at Fortune, Peregrine plans to trade on the NYSE, with Deutsche Bank Securities, JPMorgan and Jefferies & Co. serving as co-lead underwriters. It reports a $2.5 million net gain on over $67 million in revenue for the first nine months of 2009, compared to an $8.3 million loss on around $49 million in revenue for the year-earlier period. The company has raised over $120 million in VC funding since 1990. Current shareholders include Morgenthaler Ventures (14.2% pre-IPO stake), Ridgewood Partners (12%), Advanced Equities (11.1%), Wasserstein Ventures (8.6%), Palisades Ventures (6.24%) and Technology Venture Partners (6.08%).

The SEC filing may be found here.

Celeno Closes $12M Investment Round

Ra’anana, Israel – November 15, 2010 – Celeno Communications, , a leading provider of semiconductors for multimedia Wi-Fi home networking applications, today announced it has closed a $12 million funding round. The latest round includes new strategic investor Liberty Global, Inc. (“Liberty Global”) (NASDAQ: LBTYA, LBTYB, LBTYK), the leading international cable operator. In September, Liberty Global chose Celeno’s Carrier-grade Wi-Fi technology to power its multimedia home gateway. Previous investors; Cisco, Greylock Partners, Miven Venture Partners, and Pitango Venture Capital, also participated in the round.


“We invested in Celeno because their carrier-grade Wi-Fi technology is a cornerstone for delivering video throughout the home and it will be a key component in our multimedia home gateways,” said Bruce Dines, VP of Technology Investing for Liberty Global Ventures. “We were impressed with Celeno’s technology and market leadership and believe that Celeno is well positioned to address the growing needs of the cable industry for high-quality, reliable Wi-Fi solutions.”


“Celeno’s industry-leading Wi-Fi technology is powering dozens of service providers’ home networks world-wide,” said Gilad Rozen, Celeno CEO. “This funding will enable us to expand our sales and marketing activities as we grow our customer base globally, and as we continue to develop our technology leadership in the market.”


Celeno’s Wi-Fi chipsets, powered by the OptimizAIR™ technology suite, improves 802.11n Wi-Fi to deliver robust HD video with whole-home coverage. It achieves up to 10 times the range and throughput compared to legacy 802.11n solutions while maintaining a robust signal with effectively no packet loss. Celeno’s solution is client agnostic and delivers HD performance to any third-party Wi-Fi client devices. Celeno is helping to revolutionize home networks and powers them to distribute HD video content to any screen in the home wirelessly: set top boxes, iPADs, wireless TV’s, digital video recorders, media streamers, laptops, and other devices.


About Celeno

Celeno is a leading provider of high-performance Wi-Fi chips for HD multimedia and entertainment home networking applications. Powered by Celeno's system-on-chip (SoC) and its OptimizAIR™ technology, home gateways, multi-room DVRs and media servers can distribute multiple and simultaneous HD video streams to standard set-top boxes, PCs, television sets and other Wi-Fi-enabled consumer devices. Founded in 2005, the company has offices and representatives in EMEA, the U.S. and Asia-Pacific and is backed by blue chip investors including Cisco, Greylock Partners, Liberty Global, Miven Venture Partners and Pitango Venture Capital. www.celeno.com.


Friday, November 19, 2010

Aeroflex Holding Corp. Announces Pricing of Its Initial Public Offering

PLAINVIEW, N.Y., Nov 18, 2010 (BUSINESS WIRE) Aeroflex Holding Corp (NYSE: ARX) announced today the pricing of the initial public offering of 17,250,000 shares of its common stock, all of which are being issued and sold by the Company, at a price of $13.50 per share. The Company has also granted the underwriters a 30-day option to purchase up to 2,587,500 additional shares from the Company to cover over-allotments, if any. Goldman, Sachs & Co., Credit Suisse Securities (USA) LLC, J.P. Morgan Securities Inc. and Morgan Stanley & Co. Incorporated are serving as bookrunners for the offering, and Barclays Capital Inc., Stifel, Nicolaus & Company, Incorporated, UBS Securities LLC, Moelis & Company LLC, Needham & Company, LLC and Oppenheimer & Co. Inc. are serving as co-managers of the offering.

Monday, November 15, 2010

SMSC Acquires Symwave, Inc.

HAUPPAUGE, N.Y.--(BUSINESS WIRE)--SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems, today announced that it has acquired Symwave, Inc. (Symwave), a global fabless semiconductor company supplying high-performance analog/mixed-signal connectivity solutions utilizing proprietary technology, IP and silicon design capabilities. Symwave’s suite of SuperSpeed USB 3.0 compliant products and core technology deliver up to 10 times the speed of USB 2.0 devices and target external storage, cellular phones, media players, camcorders, digital cameras and other applications requiring high-speed data transfer capabilities. End products based on Symwave’s storage controller were the industry’s first to achieve the USB-IF’s USB 3.0 certification in December 2009.

“As a market leader for USB solutions, SMSC remains at the forefront of technology evolution that enhances our strong portfolio to better serve our customers and create new growth opportunities for our company,” said Christine King, President & Chief Executive Officer of SMSC. “This led to our initial investment in Symwave in 2009, whose team of engineers has since delivered the industry’s lowest power, highest performing storage products for the SuperSpeed USB market. With USB 3.0 now ready for mass deployment, SMSC is strengthening its market position through the addition of best-in-class USB 3.0 expertise to take advantage of this technological shift at the optimal time. We expect this IP will be broadly used throughout SMSC’s connectivity product portfolio.”

“SMSC has been a strong supporter of Symwave during some of the most challenging financial times in the history of our industry, and their backing enabled us to complete the product development and ramp our customers to production successfully,” said Yossi Cohen, President & Chief Executive Officer of Symwave. “We are pleased to see a successful outcome for our employees and shareholders, our customers, and our suppliers. We envisioned the emergence of USB 3.0 over 2.5 years ago and are proud of having delivered on our vision with multiple successful products.”

Symwave has developed a host of standards-based physical layer (PHY), low power analog front end (AFE) cores, integrated circuits (ICs) and semiconductor system solutions. These solutions feature patented technical innovations that enable multi-gigabit per second data transfer rates with extremely low power and excellent electrical performance. In addition, Symwave provides software, reference designs, and a complete development environment for USB storage applications.

Symwave products have already been qualified by most of the major storage OEM companies worldwide and are shipping in excess of a million units per month. This is expected to contribute to SMSC’s USB revenue stream and accelerate SMSC’s entry into the USB 3.0 market.

SMSC had previously made a $5.2 million equity investment in Symwave, resulting in a total equity stake of 14 percent, and recently provided $3.1 million in bridge financing to Symwave. Under terms of the agreement, SMSC also agreed to make cash payments to Symwave shareholders as part of an earnout provision upon achievement of certain financial goals during calendar year 2011. Headquartered in Laguna Niguel, CA, with design centers in San Diego, CA and Shenzhen, China, Symwave has approximately 90 employees, of which over 60 are in Asia. The acquisition closed on November 12, 2010.

Friday, October 29, 2010

Canesta to be acquired by Microsoft

SUNNYVALE, CALIFORNIA – October 29, 2010 – Canesta, Inc. today announced that it has signed a definitive agreement to have its products, technology, intellectual property, customer contracts, and other resources acquired by the Microsoft Corporation. Canesta is a leader in 3-D sensing technologywhich is critical to making Natural User Interfaces (NUI) possible.

According to Jim Spare, Canesta president and CEO, “This is very exciting news for the industry. There is little question that within the next decade we will see natural user interfaces become common for input across all devices. With Microsoft’s breadth of scope from enterprise to consumer products, market presence, and commitment to NUI, we are confident that our technology will see wide adoption across many applications that embody the full potential of the technology.”

Canesta is the inventor of a leading single chip 3-D sensing technology platform and a large body of intellectual property. With 44 patents granted to date and dozens more on file, the company has made breakthroughs in many areas critical to enabling natural user interfaces broadly across many platforms. Some of these include the invention of standard CMOS 3-D sensing pixels, fundamental innovations in semiconductor device physics, mixed-signal IC chip design, optics, signal processing algorithms, and computer vision software.

No details of the agreement have been disclosed. The acquisition is expected to be completed before the end of this year.

About Canesta
Canesta (
www.canesta.com) is the inventor of revolutionary, low cost electronic perception technology and leading provider of single chip CMOS 3-D sensors that fundamentally change the relationship between devices and their users. This capability makes possible true 3-D perception as input to everyday devices, rather than the widely understood 3-D representational technologies as output. Canesta’s 3-D input technology, based upon tiny, CMOS 3-D imaging chips or “sensors”, enables fine-grained, 3-dimensional depth-perception in a wide range of applications. Products based on this capability can then react on sight to the actions or motions of individuals and objects in their field of view, gaining levels of functionality and ease of use that were simply not possible in an era when such devices were blind. Canesta’s focus is on mass market consumer electronics, but many applications exist in other markets as well. Canesta is located in Sunnyvale, CA. The company has filedin excess of fifty patents, 44 of which have been granted so far.

Wednesday, October 27, 2010

Broadcom Corporation to Acquire Percello Ltd.

IRVINE, Calif., Oct. 26 /PRNewswire-FirstCall/ -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it has signed a definitive agreement to acquire Percello Ltd., a privately-held company that develops system-on-a-chip (SoC) solutions for femtocells. Femtocells are small, low power cellular base stations that extend coverage indoors where signals are weak. Used primarily in residential and enterprise business settings, femtocells communicate with a service provider's network through a broadband connection, allowing users to continue using their mobile devices without losing connectivity. The acquisition of Percello is expected to enable Broadcom to lower overall bill of material cost and accelerate the time to market for best-in-class and energy-efficient femtocell technology.

"Percello's energy-efficient and cost-optimized femtocell architecture augments our portfolio of highly integrated solutions for broadband connectivity and provides significant benefits for our customers and end users," said Greg Fischer, Vice President and General Manager of Broadcom's Broadband Carrier Access line of business. "As wireless data usage continues to expand, this technology is well-positioned to enable wireless carriers to offload both data and voice traffic, while offering subscribers better cell reception in the home and office and accelerating the introduction of new 'converged' mobile broadband services."

"Percello's femtocell technology delivers a simple and cost-effective solution that enables service providers to quickly and easily extend wireless cellular access as well as offering advanced applications and services to their subscribers," saidShlomo Gadot, Chief Executive Officer, Percello. "The combination of Percello's high performance femtocell solutions and Broadcom's broadband portfolio provides significant benefits including greater efficiencies, accelerated time to market and a world-class technology and engineering talent base."

"The femtocell market has turned the corner in 2010 with more than 1 million femtocells global shipments expected by conservative estimates this year. By 2015 we see more than 50 million femtocells being shipped annually with WCDMA femtocells making up the bulk of the market," said Aditya Kaul, Practice Director, Mobile Networks, ABI Research. "This is driven by the consumers' desire to be connected at all times, the need for increased data capacity in networks coupled with wireless service providers deploying fast, simple and cost-effective upgrades to support base stations and accelerate the introduction of advanced services like presence and location based alerts, multimedia syncing and sharing, smart phone applications and enhanced mobile video services to their subscribers."

In connection with the acquisition, Broadcom expects to pay approximately $86 million, net of cash assumed from Percello, to acquire all of the outstanding shares of capital stock and other rights of Percello. The purchase price will be paid in cash, except that a portion of such purchase price attributable to unvested employee stock options will be paid in Broadcom restricted stock units. Additional consideration of up to $12 million in cash will be reserved for future payment to the former holders of Percello capital stock and other rights upon satisfaction of certain performance goals. A portion of the cash consideration payable to the stockholders will be placed into escrow to cover indemnity obligations. Excluding any purchase accounting related adjustments and fair value measurements, Broadcom expects the acquisition of Percello to be approximately neutral to earnings per share in 2011. The boards of directors of the two companies have approved the acquisition. The transaction is expected to close in Broadcom's fourth quarter, 2010 or by the end of Broadcom's first quarter, March 31, 2011 and remains subject to customary closing conditions.

About Percello

Percello is a fabless semiconductor company offering highly integrated and low-cost digital baseband processors for WCDMA and LTE Femtocells. Founded in 2007, Percello provides innovative and customized solutions that address the key business and technological challenges of equipment vendors in the emerging Femtocell market. Percello's proven Femtocell SoC offerings reduce costs, lower power consumption, ease integration efforts, shorten development time and enhance flexibility.

About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything®.

Broadcom, one of the world's largest fabless communications semiconductor companies, with 2009 revenue of $4.49 billion, and holds more than 4,500 U.S. and 1,900 foreign patents, and has more than 7,800 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.

Monday, October 25, 2010

RDA Microelectronics files for $100M IPO

RDA Microelectronics (Shanghai) has filed an F-1 stock offering prospectus with the United States SEC on October 21st. RDA claims 2009 revenue of $118.9M and a net income of $11.3M. For the six months ending June 30, 2010, revenues were $76.2M with a net income of $8.4M.

Friday, October 22, 2010

Power Integrations Announces Strategic Investment in SemiSouth Laboratories

STARKVILLE, Miss. & SAN JOSE, Calif.--(BUSINESS WIRE)--Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced a strategic investment in SemiSouth Laboratories, Inc., a Mississippi-based manufacturer of high-voltage silicon-carbide (SiC) semiconductor devices. Power Integrations’ commitment of $30 million, which includes an equity investment in SemiSouth, a technology license and other financial commitments, will help drive the continued expansion of SemiSouth’s SiC fabrication facility and spur continued growth of clean-tech jobs in Mississippi. The companies will collaborate to drive adoption of SemiSouth’s SiC technology, which enables ultra-efficient power conversion for solar and wind inverters, hybrid/electric vehicles and other applications that benefit from exceptionally high energy efficiency.

“SemiSouth has made impressive breakthroughs in the development of silicon-carbide technology, attaining exceptionally high levels of efficiency and establishing SiC as an enabler of clean technologies such as solar energy and hybrid/electric vehicles,” stated Balu Balakrishnan, president and CEO of Power Integrations. “With a mutual focus on energy-efficient high-voltage semiconductor technology, Power Integrations and SemiSouth are natural strategic partners. We are particularly enthusiastic about investing in Mississippi’s emerging high-tech sector, where strong support from government and the academic community has created an environment highly conducive to innovation and private-sector investment.”The new relationship will be formally announced today at SemiSouth’s Starkville headquarters, located in the Thad Cochran Technology Park. A number of notable public officials will be on hand for the announcement, including Mississippi Governor Haley Barbour, U.S. Representative Gregg Harper, and Dr. Mark Keenum, president of Mississippi State University.

"Today's announcement is a testament to SemiSouth's success and to Mississippi’s growing stature as a center for technology and innovation," said Mississippi Governor Haley Barbour. “As a leader in automotive manufacturing, Mississippi understands the strategic importance of advanced power electronics, which are becoming a critical part of the supply chain as the industry migrates to hybrid/electric vehicles. Home-grown innovations like SemiSouth’s SiC technology represent a tremendous economic opportunity for our state. We welcome Power Integrations’ involvement in SemiSouth and Mississippi's clean-tech initiatives."

Added Kenney Roberts, president and CEO of SemiSouth, “SemiSouth has recently been recognized by its customers for having world-record, cost-effective, energy-efficient power semiconductor electronic products based on SiC technology. In response to unprecedented global demand for our products in energy-sensitive markets such as solar inverters, server power supplies, wind inverters, and electric vehicle development, we needed to find the right investor willing to share our vision of expansion. We welcome Power Integrations’ investment in SemiSouth’s future, to allow us to quickly expand and serve our customers on a much broader scale.”

"I applaud SemiSouth for their success in creating new clean-tech jobs for Mississippians and helping transform our state into a technology hub that will drive the future's renewable energy technologies," said U.S. Representative Gregg Harper, a freshman from Mississippi’s Third Congressional District. “Working in tandem, SemiSouth and Power Integrations are fostering the development of clean technologies that will provide renewable energy solutions throughout the world."

Founded in 2000 as a spin-out from Mississippi State University, SemiSouth is a privately held, venture-backed semiconductor company with more than 20 U.S. patents in the emerging field of high-efficiency silicon-carbide power devices. The company’s products, which include 1200 V and 1700 V transistors as well as high-voltage diodes and power modules, enable ultra-efficient power conversion and power management in applications ranging from three kilowatts to 100 kilowatts today, with products in development to serve applications up to one megawatt. The company operates a 10,000-square-foot clean-room facility at its Starkville headquarters, where it employs more than 70 people.

Power Integrations, based in San Jose, Calif., pioneered the market for high-voltage integrated circuits used in AC-DC power supplies. The company’s EcoSmart™ energy-efficiency technology drastically cuts standby energy consumption, the power wasted by electronic products that are plugged in but not in use. The company has sold nearly four billion EcoSmartchips since 1998, saving an estimated $4.4 billion of standby power and preventing millions of tons of carbon emissions. The company’s chips can be found in all manner of electronic products including computers, appliances, mobile-phone chargers, consumer electronics and LED lights.

About Power Integrations

Power Integrations is the leading supplier of high-voltage integrated circuits used in energy-efficient power conversion. The company’s innovative technology enables compact, energy-efficient power supplies in a wide range of electronic products, in AC-DC, DC-DC and LED lighting applications. Since its introduction in 1998, Power Integrations’ EcoSmart energy-efficiency technology has saved an estimated $4.4 billion of standby energy waste and prevented millions of tons of CO2 emissions. The company’s Green Room web site provides a wealth of information about “energy vampires” and the issue of standby energy waste, along with a comprehensive guide to energy-efficiency standards around the world. Reflecting the environmental benefits of EcoSmart technology, Power Integrations is included in clean-technology stock indices sponsored by the Cleantech Group (Amex: CTIUS) and Clean Edge(Nasdaq: CELS). For more information, please visit www.powerint.com.

About SemiSouth Laboratories

SemiSouth, a privately owned corporation with offices in Starkville, Mississippi, focuses on SiC power devices and electronics. It was formed in 2000 and has sold products globally through direct sales or distributors since 2005. It introduced the world’s first commercial, cost-effective normally-off SiC JFET in 2008, enabling world-record energy (over 99%) efficiency for its customers’ products in solar inverters. SemiSouth has also been recognized as a leader in energy-efficient and/or harsh-environment solutions for customers in solar, industrial power supplies, wind, electric vehicles, military-aerospace, and other key markets. More information can be obtained from its website, www.semisouth.com.

Thursday, October 21, 2010

PMC-Sierra to acquire Wintegra

SANTA CLARA, Calif.--(BUSINESS WIRE)--PMC-Sierra, Inc. (NASDAQ:PMCS), the premier Internet infrastructure semiconductor solution provider, today announced that it has signed a definitive agreement to acquire Wintegra Inc., a leading provider of highly integrated network processors optimized for mobile backhaul equipment.

Wintegra’s WinPath™ family of network processors – combined with their field-proven networking software – is used in 3G/4G base stations, fiber and microwave cell-site routers, as well as radio network controllers deployed globally in mobile networks. These single-chip solutions enable carriers to increase throughput on their mobile backhaul networks while successfully scaling and migrating to packet-based architectures.Mobile networks worldwide are reaching a breaking point driven by the explosive growth in video and data traffic fueled by the rapid adoption of 3G and 4G smartphones, tablets and netbooks. Carriers are entering into multi-year upgrades of their mobile backhaul equipment as they transition from TDM to packet-based architecture. Packet-based mobile backhaul enables carriers to cost-effectively scale bandwidth capacity to accommodate the increasing levels of media streaming that drives the projected 10 times growth in mobile data traffic over the next three to four years.

The acquisition accelerates PMC-Sierra’s product offering in the IP/Ethernet packet-based mobile backhaul equipment market segment, which is expected to grow 35 percent annually from $1.2 billion in 2009 to $5.5 billion in 2014, according to Infonetics research1.

This acquisition fits strategically with PMC-Sierra’s overall efforts to accelerate the transition of existing communications equipment to converged, packet-centric solutions. Today, PMC-Sierra is the leading provider of residential access with Passive Optical Networking (PON) solutions as well as end-to-end multi-service Optical Transport Network (OTN) solutions for Metro networks. Wintegra extends PMC-Sierra’s offerings into IP-based mobile backhaul solutions required by carriers as they upgrade their infrastructure to capture growing 3G/4G wireless data service revenues.

“Carriers are moving rapidly to IP-based mobile backhaul, and Wintegra’s product offering is uniquely positioned to enable this packet transition and breakthrough the bandwidth bottlenecks faced in mobile networks,” said Greg Lang, president and chief executive officer of PMC-Sierra. “Combined with our broad portfolio of communications infrastructure products, PMC-Sierra is leading the industry in the migration to IP-based networks in mobile backhaul, metro optical transport, and residential Fiber To The Home.”

“We’ve already been partnering with PMC-Sierra to create mobile backhaul solutions that combine our multi-service WinPath processors and networking software with PMC-Sierra’s extensive portfolio of framers and mappers,” said Kobi Ben-Zvi, founder and chief executive officer of Wintegra. “Given the strong strategic fit between the two companies, joining forces will allow us to further accelerate the industry’s transition to IP-based networks.”

Wintegra has 165 employees with the majority of its R&D development team located in Ra’anana, Israel, and Austin, Texas. The acquisition of Wintegra expands PMC-Sierra’s presence in Israel, where its FTTH business is based. Wintegra’s founders, Kobi Ben-Zvi and Robert O’Dell, will join PMC-Sierra and bring an exceptional team with strong expertise in silicon design, networking software, and system integration.

Under the terms of the deal, PMC-Sierra will pay Wintegra $240 million in cash consideration less an estimated net cash amount of $27 million on Wintegra’s balance sheet at time of closing, for a net purchase price of $213 million. PMC-Sierra intends to use its existing balance sheet cash to finance the acquisition. Further, up to an additional $60 million of cash consideration may be paid if certain growth and performance milestones are reached by the end of 2011. The acquisition has been approved by both companies’ board of directors and is expected to close in the fourth quarter of 2010 subject to customary closing conditions and regulatory approvals. The transaction is expected to be immediately accretive to PMC-Sierra’s earnings.

Wednesday, October 20, 2010

SiOnyx Raises $12.5 Million in Series B Financing

BEVERLY, Mass., Oct. 20 /PRNewswire/ -- SiOnyx Inc., a leading innovator in high-performance photonics, today announced that it has successfully completed its series B financing, closing at $12.5 million. New investors Coherent Inc., Crosslink Capitaland Vulcan Capital joined existing investors Polaris Venture Partners and Harris & Harris to complete the round. There are no resulting changes to SiOnyx's board of directors.

"The addition of a strategic partner and two top-tier venture capital firms to our series B syndicate underscores the tremendous economic potential of SiOnyx's innovation," said Stephen Saylor, CEO of SiOnyx. "Our early success in delivering record-breaking performance in applications from simple light detection to thin-film photovoltaics has fueled our momentum. With this new funding, SiOnyx will launch our first commercial products and expand the suite of solutions offered to our strategic partners."

SiOnyx is commercializing a fundamentally new semiconductor processing technique that represents a breakthrough in the development of smaller, cheaper, high-performing silicon photonic devices. The company recently demonstrated record-breaking photosensitivity in collaboration with the Army Research Office (ARO) and is currently working with a number of industry and government partners to advance the use of its technology.

"Coherent's investment in SiOnyx, one of our strategic partners, reflects our confidence in the company and its technology to help us capture new opportunities in the photovoltaic industry as it continues to expand towards grid parity," said John Ambroseo, Coherent President and Chief Executive Officer.

Vulcan Capital, the venture investment firm founded by Microsoft co-founder Paul Allen, is impressed by SiOnyx's novel technology platform. Venture partner Jill Watz added: "We expect the disruptive nature of SiOnyx's technology to create entirely new product categories and deliver powerful performance enhancements to the multi-billion dollar market for silicon photonics."

Based on a novel laser implant method first discovered at Harvard and commonly referred to as 'Black Silicon,' SiOnyx's patented semiconductor process dramatically enhances the performance of light-sensing devices across a range of applications in the consumer, industrial, medical and defense industries.

About Coherent, Inc.

Founded in 1966, Coherent, Inc. is a Russell 2000 Index company and a world leader in providing laser-based solutions to the commercial and scientific research markets. For more information about Coherent, including product and financial updates, visit our website at http://www.Coherent.com.

About Crosslink Capital

Founded in 1989, Crosslink Capital is a leading stage-independent venture capital and growth equity firm with over $1.5 billionin capital under management. Crosslink was among the first and largest investment firms in the U.S. to integrate public and private technology investing. This strategy allows Crosslink to partner with its portfolio companies on a long-term basis. With more than 20 years behind it, Crosslink Capital has invested in over 90 private equity portfolio companies, including Miller Heiman, Omniture (acquired by Adobe Systems) Pandora, SeaMicro, Twin Creeks Technologies, Virage Logic, and Yipes (acquired by Reliance Communications). For more information on Crosslink, visit http://www.crosslinkcapital.com.

About Vulcan Capital

Vulcan Capital is the private investment arm of Vulcan Inc., the company founded by Paul G. Allen in 1986 to manage his philanthropic and business initiatives. Vulcan Capital is focused on generating long-term value appreciation across a multibillion dollar portfolio, which spans diverse industry sectors and investment asset classes, ranging from early-stage venture investments to public equity value investing, leveraged buyouts, acquisitions, and distressed situations.

About SiOnyx

SiOnyx is a leading innovator in high-performance photonics serving the consumer, industrial, medical and defense industries. SiOnyx's patented semiconductor process dramatically enhances the performance of light-sensing devices, delivering hundreds of times more sensitivity to light than traditional silicon. As a result, SiOnyx's platform represents a significant breakthrough in the development of smaller, cheaper, high-performing photonic devices in applications ranging from simple light detection to advanced digital imaging, photovoltaics and more. Additional information about SiOnyx is available at www.sionyx.com.

Wednesday, October 13, 2010

Broadcom Corporation to Acquire Beceem Communications

IRVINE, Calif., Oct 13, 2010 /PRNewswire via COMTEX News Network/ -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it has signed a definitive agreement to acquire Beceem Communications Inc., a privately-held company that is a leading provider of fourth generation (4G) wireless platform solutions. Beceem has announced the industry's first 4G multimode platform that can support both LTE and WiMAX 4G networks. Supporting peak broadband download speeds of up to 200Mbps, this technology will enable truly mobile broadband connectivity for smartphones, mobile computing, consumer electronics products and wireless gateways.
The acquisition of Beceem accelerates Broadcom's time-to-market in 4G by adding a talented team with proven expertise developing and selling these solutions for a broadening ecosystem of equipment providers and operators. When combined with Broadcom's 3G/2G cellular solutions, wireless LAN, Bluetooth, GPS, Ethernet switching and other associated IP, Beceem's 4G technology will enable our combined customers to accelerate the market availability of highly integrated, lower cost 4G wireless broadband devices.
Service providers around the world are rolling out next generation 4G networks to meet the explosive demand for an expanding variety of content and the growing number of wireless connected devices per subscriber designed to access this content. Beceem's solutions address both LTE and WiMAX, the two standards associated with 4G cellular services. According to the
Global Semiconductor Alliance, 132 operators in 56 countries are investing in and are expected to deploy LTE, while WiMAX has already been deployed in over 550 networks in 148 countries. These next generation 4G networks will provide a robust mobile broadband experience at home, at work and while on the road for billions of people around the world.
"The combination of Beceem and Broadcom creates a leader in providing multimode wireless connectivity solutions to service providers and equipment manufacturers around the world," said Scott Bibaud, Broadcom's Executive Vice President & General Manager of the Mobile Platforms Group. "Beceem's talented teams of engineers in India and the U.S. have been focused on enabling a 4G ecosystem of operators and equipment manufacturers to drive the deployment of 4G networks. We look forward to adding their innovative technologies to our product portfolio and providing these technologies to our customers."
Beceem's Chief Executive Officer, Surendra Babu Mandava, said: "When combined with Broadcom's 2G and 3G cellular solutions and broader wired and wireless communications portfolio, our 4G products will enable operators to roll out next generation wireless broadband solutions while providing support for existing networks. Our combined offering will be one of the most extensive and formidable in the industry."
In connection with the acquisition, Broadcom expects to pay approximately $316 million, net of cash assumed, to acquire all of the outstanding shares of capital stock and other equity rights of Beceem. The purchase price will be paid in cash, except that portion attributable to unvested employee stock options will be paid in stock options exercisable for shares of Broadcom's common stock. A portion of the cash consideration payable to the stockholders will be placed into escrow pursuant to the terms of the acquisition agreement. Excluding any purchase accounting related adjustments and fair value measurements, Broadcom expects the acquisition of Beceem to be neutral to earnings in 2011. The boards of directors of the two companies have approved the merger. The transaction is expected to close in Broadcom's fourth quarter, 2010 or by the end of Broadcom's first quarter, March 31, 2011 and remains subject to the satisfaction of regulatory requirements and other customary closing conditions.

About Beceem
Beceem is the leading provider of 4G semiconductors and offers a number of single-chip solutions optimized for mobile devices and wireless broadband markets. Beceem's products are WiMAX certified, power the CLEAR and NOQ networks in the United States and are validated against WiMAX base stations from all major OEMs.

About Broadcom
Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R). Broadcom, one of the world's largest fabless communications semiconductor companies, with 2009 revenue of $4.49 billion, holds more than 4,300 U.S. and 1,800 foreign patents, and has more than 7,900 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.

Tuesday, October 12, 2010

Silicon Laboratories Acquires ChipSensors

AUSTIN, Texas, October 12, 2010 - Silicon Laboratories Inc. (Nasdaq: SLAB) today announced the acquisition of Ireland-based ChipSensors Limited, an early stage technology company creating innovative single-chip CMOS sensors designed to detect temperature, humidity and gases. ChipSensors’ technology complements Silicon Labs’ touch, proximity sensing and recently acquired MEMS technology, expanding the company’s capabilities in CMOS-based sensors.


ChipSensors, a fabless semiconductor company, has an experienced management and technology team with extensive materials science and mixed-signal design expertise. The company has leveraged these capabilities to develop novel sensor technology that addresses a wide range of target markets such as thermostats, automotive climate control, printers, wireless sensor networks, security systems, gas leak detectors, white goods, and food and drug transportation.


Historically, sensors have been manufactured using specialized materials and manufacturing processes that demand external support circuitry and post-assembly calibration. ChipSensors’ proprietary, patented technology can enable the sensors, signal conditioning circuits and RF transceiver functions, together with the microcontroller and memory, to be integrated and calibrated in a single CMOS IC. These highly integrated devices provide a cost-effective solution to precision sensing for high-volume applications.


“In addition to a strong alignment with Silicon Labs’ existing sensor-related R&D efforts, ChipSensors’ technology also offers synergy with our existing MCU and wireless products, targeting similar end market applications and therefore enabling more content per system and unique integration opportunities,” said Mark Downing, vice president of corporate strategy and business development for Silicon Laboratories.


“Joining forces with Silicon Labs provides us with an exceptional opportunity to both collaborate with a team that has a reputation for the highest caliber mixed-signal engineering and potentially grow the design team in Ireland to take advantage of the strong local technical talent,” said Tim Cummins, CEO and founder of ChipSensors.


About ChipSensors

Headquartered in Limerick, Ireland, ChipSensors was funded by Kernel Capital, Enterprise Ireland and ETV Capital. For more information, visit www.chipsensors.com.


About Silicon Laboratories Inc.

Silicon Laboratories is an industry leader in the innovation of high-performance, analog-intensive, mixed-signal ICs. Developed by a world-class engineering team with unsurpassed expertise in mixed-signal design, Silicon Labs’ diverse portfolio of highly-integrated, easy-to-use products offers customers significant advantages in performance, size and power consumption. These patented solutions serve a broad set of markets and applications including consumer, communications, computing, industrial and automotive.

Headquartered in Austin, TX, Silicon Labs is a global enterprise with operations, sales and design activities worldwide. The company is committed to contributing to our customers’ success by recruiting the highest quality talent to create industry-changing innovations. For more information about Silicon Labs, please visit www.silabs.com.