Friday, February 19, 2010

SMSC Acquires Kleer Semiconductor Corporation

HAUPPAUGE, N.Y.--(BUSINESS WIRE)--SMSC (NASDAQ: SMSC - News), a leading semiconductor company providing Smart Mixed-Signal Connectivity™ solutions, today announced that it has acquired substantially all the assets and certain liabilities of Kleer Semiconductor Corporation (Kleer), a designer of high quality, interoperable wireless audio technology addressing headphones and earphones, home audio/theater systems and speakers, portable audio/media players and automotive sound systems. This transaction brings a robust, high-quality audio and low-power radio frequency (RF) capability that will allow consumer and automotive OEMs to integrate wireless audio technology into portable audio devices and sound systems without compromising high-grade audio quality or battery life.

“Kleer technology provides a natural extension to SMSC’s consumer and automotive connectivity portfolio,” said Christine King, President & Chief Executive Officer of SMSC. “With its Media Oriented Systems Transport (MOST®) technology, SMSC’s automotive product line already provides a wired network that allows passengers to enjoy multimedia content without sacrificing quality or performance. MOST is widely recognized as the de-facto standard to move high-bandwidth content among various components within the vehicle. Kleer technology provides a high quality wireless extension of MOST without quality degradation and with low power consumption. This technology extends our ability to service our OEM customers with a broad portfolio of solutions that significantly enhance the user experience in the car and elsewhere.”

Kleer-based products are designed to provide high quality media transmission in various environments with strong interference robustness and WiFi coexistence to enhance the user experience. The technology has many natural applications in the consumer world to create high-fidelity home theater environments and distribute audio in the home and other environments. Several consumer customers already offer products with Kleer technology, including Sennheiser, the well-known headphone brand, which offers several models of digital wireless headphones and earbuds with high audio quality and long battery life. TDK recently introduced the highly-regarded Kleer-based TH-WR700 wireless headphones. In addition, DigiFi’s wireless earbuds and CyFi’s speaker system for bicycles both rely on Kleer’s low power consumption.

Under terms of the asset purchase agreement, SMSC paid approximately $5.5 million in cash and additional cash payments of up to $2.0 million may occur upon achievement of certain performance goals. The acquisition closed on February 16, 2010.

Wednesday, February 3, 2010

Broadcom to acquire Teknovus

IRVINE, Calif., Feb 03, 2010 /PRNewswire via COMTEX News Network/ -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it has signed a definitive agreement to acquire Teknovus, a leading supplier of Ethernet Passive Optical Network (EPON) chipsets and software. EPON is a technology providing broadband services at up to 10 Gigabits per second over fiber optic cables. EPON represents approximately 94% of the FTTx (e.g. Fiber-to-the-Home) connections in the Asia Pacific region. According to the Dell'Oro Group, the Asia Pacific PON market is expected to grow from 22.8 million to 94.5 million subscribers by 2014, a CAGR of 33% (2009-2014).

"Teknovus has a strong product and has established a solid reputation with our existing customers," said Martin Lund, Senior Vice President and General Manager, Broadcom's Network Switching line of business. "Today Broadcom has switching, DSL, GPON, and cable solutions in the service provider segment that span from the access to the core of the network. Teknovus' products will add a key element to our existing service provider offering that will enable us to better serve our customers in this segment."

"Broadcom is known globally for its Ethernet switching expertise," said Greg Caltabiano, President and CEO, Teknovus. "As the EPON market segment evolves and expands, technologies from both companies can be combined to enable a higher performance, lower cost EPON-based access infrastructure."

In connection with the acquisition, Broadcom expects to pay approximately $123 million to acquire all of the outstanding shares of capital stock and other rights of Teknovus. The purchase price will be paid in cash, with a portion placed into escrow pursuant to the terms of the acquisition agreement. Excluding any purchase accounting related adjustments and fair value measurements, Broadcom expects that the acquisition of Teknovus will be approximately neutral to earnings per share in 2010. The boards of directors of the two companies have approved the merger. The closing, which is expected to occur in the first or second quarter of this year, remains subject to the satisfaction of regulatory requirements and other customary closing conditions.

Tuesday, February 2, 2010

Black Sand Announces Acquisition of CMOS PA IP from SiLabs

AUSTIN, Texas--(BUSINESS WIRE)--Black Sand Technologies, Inc., a specialist in advanced power amplifier technology for wireless applications, today announced that it previously acquired a patent portfolio related to CMOS power amplifiers (PAs) from Silicon Laboratories.

According to the terms of the transaction, Black Sand received a number of issued and pending patents from Silicon Laboratories. The U.S. and international patents include claims and methods related to power amplifier architectures and implementations that can be used in a CMOS process.

In September, Black Sand announced the world’s first 3G CMOS RF PA. Black Sand’s proprietary CMOS PA architecture offers a breakthrough in combined performance, cost, battery life, and reliability for mobile devices.

“The acquired IP represents important technology for Black Sand, significantly advancing our position as the leader in this field,” said John Diehl, CEO of Black Sand. “When combined with our internally developed IP, these foundational patents give us a unique combination of outstanding technology and substantial IP.” Detailed terms of the agreement were not disclosed.

Black Sand’s RF PA products are targeted at mobile phones and other 3G wireless devices, such as datacards and netbooks. Mobile phones and wireless products today use power amplifiers based on Gallium Arsenide (GaAs) semiconductor technology. Replacing GaAs with CMOS improves manufacturing yield, performance, cost, battery life, and call quality.