Wednesday, March 31, 2010

Xceive Raises $16 Million in Additional Financing

SANTA CLARA, CA (PRWEB) March 30, 2010 -- Xceive Corporation, the world leader in RF Tuner ICs for TV sets, announced today that it has secured recent funding in excess of $16M in a combination of Series E equity and debt financing. The Series E round was led by AVM Capital LP and Scale Venture Partners with other existing investors participating. This round of funding will be used primarily to fund new product development and the Company’s rapid expansion and growth.

“We have succeeded in achieving the number one position in silicon tuners for television, and we are very pleased that our investors are showing their commitment by continuing to fund our growth”, said Jean Louis Bories, President and CEO of Xceive. "This round of financing is a significant milestone for Xceive as it validates the rapid growth of our business evidenced by the continual adoption of our chips by major television manufacturers.”

This financing comes as a result of Xceive succeeding as the first and only Tuner IC company to achieve significant and widespread usage by TV OEMs such as LG, Amtran/Vizio, and other top TV manufacturers in Japan, Korea, Taiwan, China and Europe. Xceive’s tuner products are 100% compatible with all worldwide analog and digital television standards and are currently shipping in TVs for nearly all major markets worldwide. This financing will fund development of enhanced next-generation chip designs and also company expansion to address more customers and applications.

About Xceive

Xcieve is a venture-backed fabless semiconductor company developing RF silicon solutions for television signal reception which replace the bulky “Can” tuner modules traditionally used inside television sets. Xceive is producing the XC5000, the first silicon tuner which provides performance surpassing that of tuner modules. Xceive is the first silicon tuner manufacturer to achieve design wins and production ramps with several Tier one TV manufacturers. Xceive estimates that nearly 10 million TV sets have been produced for all regions of the world with its industry-leading XC5000 multi-standard tuner plus analog demodulator. This demonstrated market adoption highlights the flexibility of Xceive’s proprietary architecture which achieves true compatibility with all worldwide digital and analog TV standards.

Friday, March 26, 2010

MoSys Acquires MagnaLynx Inc.

SUNNYVALE, Calif.--(BUSINESS WIRE)--MoSys, Inc., (NASDAQ: MOSY), a leading provider of differentiated, high-density memory and high-speed interface (I/O) intellectual property (IP), today announced that it has acquired MagnaLynx Inc. a developer of high-speed, low-power serial chip-to-chip communications technology.

The acquisition is expected to result in the following benefits to MoSys:

  • Adds innovative low-power SerDes IP, technology and expertise to the expanding MoSys family of product offerings.
  • Expands MoSys’ serial chip-to-chip communications technology and expertise
  • Strengthens MoSys’ SerDes capabilities by adding another very experienced, high caliber analog and mixed-signal development team
Founded in Ames, Iowa in 2003, MagnaLynx specializes in high-performance, low-power SerDes design services and IP cores for network communications and high performance computing applications.

“Becoming the leader and a prime innovator in high-speed SerDes technology as applied to board level serial chip-to-chip communications is a critical part of our growth strategy, for both our IP business and our recently announced Bandwidth Engine™ family of ICs. In June last year, we acquired Prism Circuits, and today I am pleased to announce the addition of the MagnaLynx team to the expanding MoSys family,” said Len Perham, MoSys’ president and CEO. “In addition to expanding our overall SerDes engineering team, MagnaLynx brings us unique expertise and technology in low-power techniques for high-speed SerDes and considerable experience in enabling serial chip-to-chip communications.”

Scott Irwin, MagnaLynx founder and chairman said, “We started MagnaLynx with the vision of bringing revolutionary, high-speed, low-power serial chip-to-chip communications capability to the market. By joining forces with MoSys, it will dramatically accelerate our ability to achieve that vision. The team and I are very excited to join MoSys and look forward to contributing both to the MoSys’ IP business and the Bandwidth Engine IC products.”

The total purchase price is expected to be approximately $5.0 million, including a milestone-based earn-out payment in 2011.

Forward-Looking Statements

This press release may contain “forward-looking statements” about MoSys, including, without limitation, expected benefits from the acquisition of MagnaLynx, benefits and performance expected from use of MoSys’ embedded memory and I/O technologies and Bandwidth Engine ICs, MoSys’ execution and results, market size, growth of MoSys’ business and future markets and future business prospects.

About MoSys, Inc.

MoSys, Inc. (NASDAQ: MOSY) develops serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs. MoSys’ IP portfolio includes DDR3 PHYs and SerDes IP that support data rates from 1 - 11 Gigabits per second (Gbps) across a variety of standards. In addition, MoSys offers its flagship, patented 1T-SRAM® and 1T-Flash® memory cores, which offer a combination of high-density, low power consumption, high speed and low cost advantages for high-performance networking, computing, storage and consumer/graphics applications. MoSys IP is production-proven in more than 225 million devices. MoSys is headquartered in Sunnyvale, California. More information is available on MoSys' website at www.mosys.com.

About MagnaLynx Inc.

MagnaLynx Inc., headquartered in Ames, Iowa, was formed in 2003 to develop leading edge high-speed serial interface technology focused on chip-to-chip applications.

MoSys, 1T-SRAM and 1T-Flash are registered trademarks of MoSys, Inc. Additionally,, the MoSys logo and Bandwidth Engine are registered trademarks of MoSys, Inc.

Tuesday, March 23, 2010

MaxLinear Prices Initial Public Offering

CARLSBAD, Calif.--(BUSINESS WIRE)--MaxLinear Inc. (NYSE:MXL), a provider of radio frequency (RF) and mixed-signal IC solutions for broadband communications applications, today announced the pricing of the initial public offering of 6,444,100 shares of Class A common stock at a price to the public of $14.00 per share. The shares will begin trading on the New York Stock Exchange on March 24, 2010 under the ticker symbol “MXL.” Of the shares of Class A common stock in the offering, MaxLinear is offering 5,148,059 shares and selling stockholders are offering 1,296,041 shares. In addition, MaxLinear and the selling stockholders have granted the underwriters a 30-day option to purchase up to an additional 966,614 shares of Class A common stock, with up to an additional 771,469 shares to be sold by MaxLinear and up to an additional 195,145 shares to be sold by the selling stockholders, solely to cover over-allotments, if any.

Morgan Stanley & Co. Incorporated and Deutsche Bank Securities Inc. are acting as joint book-running managers for the offering. UBS Securities LLC, Thomas Weisel Partners LLC, and Needham & Company, LLC are acting as co-managers.

A registration statement relating to this offering was declared effective by the Securities and Exchange Commission on March 23, 2010. This offering is being made solely by means of a prospectus, copies of which may be obtained from: Morgan Stanley & Co. Incorporated, 180 Varick Street, 2nd Floor, New York, New York 10014, Attention: Prospectus Department, or by calling (866) 718-1649 or by emailing prospectus@morganstanley.com; or by contacting Deutsche Bank Securities Inc., Attn: Prospectus Department, 100 Plaza One, Jersey City, New Jersey 07311, telephone: (800) 503-4611 or e-mail at prospectusrequest@list.db.com.

This press release shall not constitute an offer to sell or the solicitation of an offer to buy, nor shall there be any sale of these securities in any state or jurisdiction in which such an offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction.

About MaxLinear, Inc.

MaxLinear, Inc. is a provider of radio frequency (RF) and mixed-signal IC solutions for broadband communications applications. MaxLinear’s high performance RF receiver products capture and process digital and analog broadband signals to be decoded for various applications. MaxLinear’s current products enable the display of broadband video in a wide range of electronic devices, including cable and terrestrial set top boxes, digital televisions, mobile handsets, personal computers, netbooks, and in-vehicle entertainment devices. MaxLinear is based in Carlsbad, California.

Thursday, March 18, 2010

Energy Micro secures $13 million funding

Oslo, Norway, March 2010 – Energy Micro®, the energy friendly microcontroller company, has announced that it has secured an investment of $13 million from Northzone Ventures and Investinor in its first external funding round.

The investment will be used to continue the development of Energy Micro’s microcontroller product portfolio, to develop and bring to market a family of energy friendly radio products and to expand the organisation and sales channels to support future high growth.

Energy Micro launched its first product, the 32-bit EFM32 Gecko microcontroller family, in October 2009. Consuming a quarter of the energy of existing 8-, 16- or 32-bit microcontrollers, the products have been well received in energy sensitive application sectors, including energy metering, home and building automation, alarm and security systems and medical equipment.

Torleif Ahlsand, General Partner of Northzone Ventures, who joins Energy Micro’s board of directors as Chairman, said: "Northzone has followed Energy Micro’s progress for more than a year now, and I am very excited about the company’s prospects. Energy Micro is the first investment in our recently announced Northzone VI fund, and it gives us a tremendous start."

He continued: "Energy Micro has all the ingredients in place to make it a real success; with differentiated products and technology promising quantum leap performance improvements , and an outstanding management and engineering team. We are proud to be associated with such a dream team."

Steinar Fossen, Investment Director of Investinor, who becomes an Energy Micro board member, said: "Investinor are excited to have this opportunity to join Energy Micro’s strong team. Energy Micro is a great match with Investinor, which invests in early stage Norwegian companies aiming for high growth on a global scale. We look forward to participating in Energy Micro’s future success."

Geir Førre, Founder and CEO of Energy Micro said: "Energy Micro had the enviable position to be able to choose from a number of top tier VCs who all wanted to invest in the company. We are very proud to have Northzone and Investinor as our first external investors and members of the board, and believe they will contribute significantly to the company’s development and growth in the coming years."

TAGSYS raises €8M in Series D Round

TAGSYS, the leading provider of item-level RFID infrastructure, today announced that it has secured €8 million ($12 million USD) in new investment, led by current investors Elliot Advisors, Endeavour Vision, Add Partners, DFJ Esprit and Saffron Hill. TAGSYS will use the funds to expand its distribution channels, help partners secure new markets, and continue to develop UHF and HF solutions optimized for item-level applications for a variety of markets including Library, Textile Services, Brand & Fashion and Healthcare.

“2009 was a year of successes for TAGSYS. While increasing revenue, and closing major projects, we improved operational efficiency by 40% and established processes that assure our customers and partners superior levels of quality, delivery and solution reliability,” said Alain Fanet, CEO of TAGSYS. “The new funding will accelerate our partner network expansion and new market development, while reinforcing our strong competitive position by launching leading-edge solutions for item level applications.”

“Item-level RFID implementations are growing in supply chain, asset tracking, consumer goods, retail and other industries because they provide real value by helping companies cut costs, enhance customer experiences and grow sales,” said Andrew Nathanson, Director of Research Operations at VDC Research. “Companies like TAGSYS who can meet customer needs in multiple markets by bringing together appropriate technologies and business partners are well positioned to grow in the current adoption climate.”

Leveraging a global network of business partners including systems integrators, independent software vendors and VARs, TAGSYS’ business model provides complete purpose-built infrastructure to customers. This go-to-market strategy has led to wins in several major applications throughout the past year, including item-level supply chain projects with Fashion Apparel firms Rica Lewis and Serge Blanco. The companies use TAGSYS solutions to track millions of clothing items, and to manage in-store inventory at leading European retailers including Carrefour, Auchan and IntermarchĂ©.

“After years of over-hyped expectations, the RFID market has reached a stage of maturity where customers are focused on the proven tangible benefits of RFID and using practical, real-world solutions to gain competitive operational advantage” said Bernard Vogel of Endeavour Vision. “Industry leading RFID solutions-based companies such as TAGSYS are at the forefront in delivering this competitive advantage to leading companies around the globe.”

About TAGSYS
TAGSYS provides complete, reliable, high performance RFID infrastructure systems for item-level tracking in a variety of industries. Our unique RFID expertise, combined with a true understanding of RFID business processes, make us the ideal RFID partner to ease and ensure the success of your project. With a proven track record of delivering reliable, high performance production systems, TAGSYS has deployed RFID systems to over 500 customers in more than 40 countries. More information on TAGSYS can be found at www.tagsysrfid.com.

Wednesday, March 17, 2010

LucidLogix Receives Addtional $8M from Current Investors

KFAR NETTER, Israel, and SANTA CLARA, California, March 16, 2010 — In response to recent sales of HYDRA 200 real time distributed processers for use in the consumer gaming and professional PC markets, LucidLogix Technologies has received an additional $8 million in funding from current investors Rho Ventures, Giza Venture Capital and Genesis Partners, bringing total capitalization to $40 million.

The funds are intended to be used for sales support, accelerate market penetration of current products, and for research and development of future technologies.

Moshe Steiner Lucid CEO said, “The confidence level of our investors has come from our ability to successfully launch and deliver our second generation HYDRA 200 product to mass production, which is already on motherboards from one of the top three manufacturers in the world, MSI, and with more partners in the pipeline. The additional investment will enable the company to expand to international markets and boost sales.”

Backed by a multitude of patents and patents pending, Lucid provides an innovative graphics scaling solution. The HYDRA 100 and HYDRA 200 real time distributed processors are the only products available today that can scale graphics performance using GPUs from any vendor for performance and system flexibility.

“Lucid is making the natural transition from a research and development startup to a silicon-product company,” said Offir Remez, Lucid co-founder and President. “We are working with leading strategic partners in the PC market during this critical time to deliver on our promises and grow the company, therefore the ongoing support by our investors is extremely valuable.”

Target markets for the company include motherboards and add-in boards for desktops and mobile platforms, a space where giants like Intel, NVIDIA and AMD find their growth.

About Lucid

LucidLogix Technologies has reinvented multi-core graphics with its HYDRA real-time distributed processing engine that improves visual computing for both business and gaming applications. A fabless SoC provider, headquartered in Kfar Netter Israel with sales and marketing in Santa Clara, California, Lucid’s innovations are protected by more than 60 patents and patents pending. For more information visit the Lucid website or follow @LucidHYDRA on Twitter.

Friday, March 12, 2010

SiBEAM, Inc. Secures $36.5 Million in Series D Funding

Sunnyvale, California – March 09, 2010 – SiBEAM, Inc., the leading innovator of millimeter wave (mmWave) solutions and developer of high-speed wireless communications platforms, today announced the closing of $36.5 million in Series D funding led by Foundation Capital. All of SiBEAM’s original investors contributed to this round including U.S. Ventures Partners (USVP) and New Enterprise Associates (NEA), joined by new partners in SiBEAM’s success, Lux Capital and Hatteras Funds. Best Buy Inc, and Cisco have also contributed strategic equity investments to support SiBEAM’s growth and propel its second generation 60 GHz wireless high definition chipsets into the mainstream consumer electronics marketplace, as well as fund future projects for personal computing and mobile devices.

"SiBEAM continues to deliver on its promise to bring high-quality, lossless wireless high definition capabilities to the A/V home entertainment market. Their team has executed well on its plans and has brought in nearly all leading CE manufacturers as customers through its work with the growing WirelessHD® Consortium,” said Adam Grosser, General Partner at Foundation Capital. “This market adoption further supports our confidence in SiBEAM’s technology and the team’s capabilities to drive and solidify the company’s leadership in the exciting and high-growth wireless connectivity market.”

SiBEAM’s 60 GHz semiconductor solutions with OmniLink60™ Technology have won multiple awards, most recently being honored with a 2010 Design Vision award in the semiconductor components category. The second generation of SiBEAM’s WirelessHD chipsets, brought into mass production earlier this year, represents the company’s movement into mass market applications with low cost, low power functionality. SiBEAM’s latest chipsets also support advanced features demanded by today’s consumer electronics market including 3D, HDCP and DTCP content protection that can be designed into A/V receivers, home theater-in-a-box systems, Blu-ray players, set-top boxes, media center PCs, and consumer laptops. "We're proud to be SiBEAM investors," said Peter Hebert, Co-Founder and Managing Partner at Lux Capital.

"With exceptional leadership and committed corporate partners, SiBEAM has become the indispensable technology innovator in wireless home networking."

As a founding member of the WirelessHD Consortium that includes 50 worldwide leaders in consumer electronics and personal computing industries, SiBEAM’s OmniLink60™ Technology is the first WirelessHD-based solution capable of streaming uncompressed high definition video, audio and data.

“This round of financing is a significant milestone for SiBEAM as it demonstrates the continued growth of our business and potential for significant investment return even in a challenging economy. With these funds, we can grow our business toward profitability in the burgeoning wireless A/V market,” said John LeMoncheck, President and CEO of SiBEAM, Inc. “SiBEAM continues to receive extensive interest from CE and PC manufacturers worldwide that are eager to integrate simple, cost effective and high quality wireless streaming capability into their products.”

Based on the WirelessHD standard, SIBEAM’s semiconductor systems provide the first and only
available option to deliver lossless, uncompressed wireless high definition audio, video and data. SiBEAM's advanced wireless technology solutions are designed for consumer electronics manufacturers, PC manufacturers, network infrastructure providers and others to incorporate into their next generation product lines for wireless communications. SiBEAM is currently expanding global sales and manufacturing operations to support the company’s elevated growth rate and customer demand for wireless A/V connectivity solutions

About SiBEAM, Inc.

Founded in 2004, SiBEAM is a fabless semiconductor company developing intelligent millimeter wave technologies and leveraging the latest manufacturing methods to meet the demand for high- bandwidth services. SiBEAM is the first to build 60 GHz chipsets using CMOS technology. The first of many applications for SiBEAM’s innovative technology is based on WirelessHD®. As a founding member of the WirelessHD® Consortium, SiBEAM is a leader in driving the architecture and semiconductor implementation for the distribution and presentation of high-definition content in the consumer electronics and personal computing markets.

Thursday, March 11, 2010

Ralink and TrendChip Enter Into Merger Agreement

Hsinchu, Taiwan, March 11, 2010 – Ralink Technology Corporation (TAIEX 3534, Ralink), a leading developer of high performance wireless solutions, and TrendChip Technologies Corporation (TAIEX 3614, TrendChip), a leading supplier of broadband connectivity chipsets, today announced that a merger agreement has been approved by the Board of Directors to create a global technology leader in the home networking and broadband access semiconductor markets. Under the terms of this agreement, the Board of Directors from both companies have agreed that the merged company will be called Ralink Technology Corporation, and that each 0.8209 share of TrendChip will be exchanged for 1 share of Ralink. With a combined stock valuation of approximately NT$20 billion, and combined 2009 revenues of over NT$7.3 billion, the new Ralink Technology Corporation is among the world’s “Top 30” fabless semiconductor companies as ranked by IC Insights based on revenue.

Ralink, founded in 2001, is headquartered in Hsinchu, Taiwan, and operates an advanced development center in Cupertino, California. Ralink’s 802.11n solutions are shipping with customers in the Americas, Europe, and Asia, and are embedded in hundreds of products across all major Wi-Fi market segments including personal computers, broadband gateways, digital televisions, Blu-Ray players, web cameras, and IPTV set-top-boxes. TrendChip, also founded in 2001, is headquartered in Hsinchu, Taiwan, and maintains development centers in Suzhou and Nanjing China. TrendChip is among the fastest growing xDSL CPE semiconductor suppliers in the market with over 90% growth in 2009. TrendChip’s solutions have been deployed by 50 carriers in 45 countries across Europe, Asia, and the Americas. With its high performance yet cost-effective xDSL solutions, TrendChip is on track to become the number 2 global xDSL CPE chip supplier in 2010.

“Ralink and TrendChip have worked closely over the past several years to win joint designs with common customers across the globe,” said Shinjou Fang, Chairman of TrendChip Technologies. “Both Ralink and TrendChip share a similar vision of the Networked Digital Home, and both companies are executing on similar strategies to deliver industry-leading performance at disruptive price points. By merging the two companies Ralink Technology Corporation will be able to leverage our combined resources, operational efficiencies, and complementary technologies to deliver superior solutions to our customers and increased value to our shareholders.”

“By combining Ralink and TrendChip into a single company, Ralink Technology Corporation will be positioned to drive the growth of high-performance yet cost-effective ‘triple play’ voice, video, and data services throughout the Networked Digital Home,” said Chris Kao, Chairman of Ralink Technology. “Broadband Gateways will incorporate our DSL and Wi-Fi chipsets, and they will deliver wireless content throughout the home to personal computers, televisions, phones, and other consumer electronics devices. With our combined forces and technologies, we anticipate accelerated growth in both existing and adjacent market segments over the coming years.”

Management of the combined 600 person company will include executives and board members from both organizations. To streamline integration of the two companies, and to maximize operational efficiencies during the transition period, Ralink Technology’s Board of Directors has appointed Shinjou Fang, Chairman of TrendChip Technologies, to be CEO of Ralink Technology and Chris Kao will continue to serve as Chairman.

About Ralink Technology

Ralink Technology Corporation is a leading innovator and developer of wireless chipset solutions. Our products are recognized for their superior throughput, extended range, low-power consumption, and consistent reliability. Ralink’s patented Wi-Fi technology is used in various applications including traditional PC networking, broadband gateway connectivity, and consumer electronics applications. Ralink Technology was founded in 2001 with headquarters in Hsinchu, Taiwan and maintains an Advanced R&D center in Cupertino, California. For more information about Ralink please visit our website at http://www.ralinktech.com

About TrendChip Technologies

TrendChip Technologies Corporation is a leading supplier of broadband access chipsets. The company's cost-effective ADSL chipsets and software deliver industry-leading performance that has been widely adopted by world-class telecommunications customers across the globe. Worldwide product shipments have grown steadily since the company was founded in 2001, and grew by more than 90 percent in 2009 enabling the company to achieve more that 25% global market share in 2009.

Monday, March 8, 2010

Tilera Closes C-Round Financing With $25 Million

SAN JOSE, Calif., March 08, 2010 - Tilera® Corporation, developer of breakthrough high-performance TILE™ family of multicore processors, today announced that is has closed out a $25 million series-C round of investment financing. The round was oversubscribed and included funds from three new strategic investors: Broadcom, Quanta Computer and NTT Financing Corp.

“We have grown revenues, design wins, and market momentum in one of the toughest years the industry has seen,” said Omid Tahernia, CEO of Tilera. “The closure of this investment round is another sign of Tilera’s growing success. We welcome our new strategic partners to the table and are looking forward to our future development plans.”

Tilera intends to use this final round of funding primarily to broaden its product portfolio and for the expansion of sales activities. This brings the total venture capital investment in Tilera to $64 million.

Tilera has two product families, the TILE and TILEPro™, currently shipping to customers in networking, wireless infrastructure, communications and cloud computing markets. In October 2009 Tilera announced its TILE-Gx™ family, which includes the world’s first 100-core processor. This line will begin sampling later this year.

About Tilera

Tilera® Corporation is the industry leader in highly scalable general purpose multicore processors for networking, wireless, and multimedia infrastructure applications. Tilera's processors are based on its breakthrough iMesh™ architecture that scales to hundreds of RISC-based cores on a single chip. The distributed nature, of Tilera's revolutionary architecture, and the standards-based tools, including ANSI C/C++ compiler, GNU tools and Eclipse IDE, deliver an unprecedented combination of performance, power efficiency and programming flexibility. Tilera was founded in October 2004, and now provides two product families: TILE64™ processors and TILEPro™ processors, with its latest TILE-Gx family due out in late 2010. The company is headquartered in San Jose, Calif., with locations in Westborough, Mass., Yokohama, Japan, Shanghai, China and Beijing.

Thursday, March 4, 2010

Audience closes $15M Series E funding

MOUNTAIN VIEW, Calif. – March 2, 2010 –Audience, Inc. announced today that is has closed a new round of financing with $15 million in Series E funding from existing investors New Enterprise Associates (NEA), Tallwood Venture Capital, Vulcan Capital and VentureTech Alliance. This brings total funding to date to $75 million and supports continued product development and rollout of the company’s industry-leading noise suppression technology for mobile phones across global markets.

“This latest round of funding provides a strong endorsement of our business achievements which include expansion of our portfolio of advanced voice processors and rapid market growth through partnerships with leading handset manufacturers and mobile service providers,” said Peter Santos, president and chief executive officer, Audience. “Audience dynamic noise suppression technology is redefining the mobile customer experience by providing unsurpassed call clarity even in noisy environments, enabling successful communications nearly anywhere. We see exciting opportunities to continue advancing voice quality, and to enable speech as the next generation interface for mobile phone applications.”

Audience voice processor chips for the mobile and telecom marketplace are based on reverse-engineering the human hearing system to optimize voice communication and speech-based applications in noisy environments. Designed to mimic the functions of the human auditory pathway, the Audience voice processor can distinguish and identify sounds, isolate the primary voice in conversation and cancel out background noise, intermittent sounds (siren, nearby conversation) and echoes, to improve mobile call quality. It also automatically equalizes and adjusts voice volume to optimize the calling experience, so the user can hear clearly without the need to speak over surrounding noise. In addition, the technology enhances performance for speech-based mobile applications such as voice search and user verification and is applicable across a broad range of consumer products where voice needs to be intelligible in noisy environments.

About Audience

Audience is a voice processor semiconductor company that enables clear communications anywhere with noise suppression technology based on the intelligence of the human hearing system. The technology is applicable across a broad range of consumer products where voice needs to be intelligible in noisy environments. Audience was the Silver Winner in the 2008 Wall Street Journal Technology Innovation Awards and the Winner of the Semiconductor category. The company was included in Gartner’s “Cool Vendors in Semiconductors, 2008” and selected as the Most Innovative True Mobile Start-Up for the “2008 GSMA Mobile Innovation Global Awards.” Audience is one of 34 founding member companies of the Open Handset Alliance and the only provider of advanced noise suppression technology. Investors in Audience include New Enterprise Associates, Vulcan Capital, Tallwood Venture Capital and VentureTech Alliance. Audience is based in Mountain View, California.