Tuesday, December 20, 2011

EnVerv Raises $12M Round of Financing

SAN JOSE, Calif.--(BUSINESS WIRE)--EnVerv Inc., an innovative fabless semiconductor company developing high performance Communications System on Chip (SoC) solutions for the Smart Grid market announces the closing of $12M Series B round of funding led by Benchmark Capital. Previous investors, NEA and Walden International participated in the round also.

EnVerv is among a handful of companies working on highly integrated multi-standard (such as G3-PLC, PRIME, S-FSK and EnVerv’s TurboPLC™) narrowband PLC modems. EnVerv’s PLC enable applications in Advanced Metering Infrastructure (AMI), Solar Inverters, Active Lighting, Industrial Control & Remote Monitoring markets where emphasis on mission critical communications and reliable data transmission across power line networks are required.“Mission critical connectivity is the cornerstone of building reliable smart grids worldwide and EnVerv’s SoC products provide the best solution for smart grid communications,” said Bruce Dunlevie, General Partner at Benchmark Capital. “Successful delivery on an array of high performance Power Line Communications (PLC) SoCs in just over a year is a testament to EnVerv’s laser focused execution and innovative product design. At Benchmark, we look forward to working with EnVerv’s management to help continue with this success.”

“We are very pleased to see Benchmark join our current investors in support of our vision to make EnVerv the leading provider of energy management solutions in the market,” said Shahin Hedayat, Chief Executive Officer of EnVerv. “This investment will enable us to capitalize on our technical achievements to scale customer support and volume production of our high performance multimode PLC chips.”

EnVerv’s PLC technology has been field trialed worldwide and has received customer acceptance in all major markets.

About EnVerv Inc.

EnVerv is a fabless semiconductor company in the United States with Headquarters in San Jose, California and offices in San Diego and Shenzhen, China. EnVerv’s PLC SoC solutions enable high performance communications via Low-Voltage (LV) and Medium-Voltage (MV) power lines with the goal of providing efficient and effective communications means for Advanced Metering Infrastructure (AMI) as well as other power line-based smart control and monitoring applications. Base node and gateway devices’ core features include: Multimode PLC modem (x–FSK, G3, PRIME and TurboPLC™) and worldwide frequency band support from 10KHz to 500KHz. For more information please visit www.enverv.com.

Linear Technology acquires Dust Networks

MILPITAS, Calif.--(BUSINESS WIRE)--Linear Technology Corporation (NASDAQ: LLTC), a leader in high performance analog integrated circuits, today announced the acquisition of Dust Networks, Inc., a leading provider of low power wireless sensor network (WSN) technology. The acquisition of Dust Networks, based in Hayward, CA, will enable Linear to offer a complete high performance wireless sensor networking solution. Dust Networks’ low power radio and software technology complements Linear’s strengths in industrial instrumentation, power management and energy harvesting technology.

Dust Networks’ proven, low power wireless sensor network technology extends Linear’s product portfolio into key growth areas in industrial process control, data acquisition and energy harvesting. Dust Networks’ ultralow power wireless systems complements Linear’s analog and digital sensor interface ICs, and energy harvesting power management products in applications where measurement of physical parameters has traditionally been impractical or impossible.

Erik Soule, Vice President of Signal Conditioning and High Frequency products for Linear Technology, stated, “Dust Networks offers the lowest power radio technology and most complete networking software for building industrial-grade wireless sensor networks. Combined with Linear’s precision low-power sensor interface products and battery-free energy harvesting technology, we can now offer the industry’s highest performance remote monitoring solutions.”

With the growing importance of machine-to-machine communications to enable remote data acquisition, low power wireless sensing is an emerging solution for many end-markets, including industrial process control, building automation and data center energy management.

Joy Weiss, President of Dust Networks, stated, “Dust Networks and Linear are an excellent fit. We already have very complementary products and customers, and with Linear’s global sales reach we can be at the forefront, enabling sensor networks to go wireless on an even broader scale.”

“Smart Dust” was first conceived by Dr. Kris Pister, founder and chief technologist of Dust Networks, as a simple way to deploy intelligent wireless sensors. Dust Networks pioneered SmartMesh® networks that comprise a self-forming mesh of nodes, or “motes,” which collect and relay data, and a network manager that monitors and manages network performance and sends data to the host application. This technology is now the basis for a number of seminal networking standards. The hallmark of Dust Networks’ technology is that it combines low power, standards-based radio technology, time diversity, frequency diversity, and physical diversity—to assure reliability, scalability, wire-free power source flexibility, and ease-of-use. All motes in a SmartMesh network—even the routing nodes—are designed to run on batteries for years, allowing the ultimate flexibility in placing sensors exactly where they need to go with low cost “peel and stick” installations.

Dust Networks’ customers range from the world’s largest industrial process automation and control providers such as GE and Emerson, to innovative, green companies such as Vigilent and Streetline Networks. Dust Networks’ technology can be found in a variety of monitoring and control solutions, including data center energy management, renewable energy, remote monitoring, and transportation.

Terms of the transaction were not disclosed. Although there will be some transaction related costs, Dust’s ongoing results are not expected to be material in the short term to Linear’s financial statements.

About Dust Networks

Founded in 2002, Dust Networks is a pioneer in the field of wireless sensor networking, and is defining the way to connect smart devices. Using standards-based network technology, Dust Networks provides reliable, resilient and scalable products with advanced network management and comprehensive security features. Dust’s broad portfolio includes SmartMesh®IP, SmartMesh Industrial/WirelessHART™ and ZigBee®. Dust Networks provides complete wireless systems solutions, including IEEE 802.15.4 mote modules, mote-on-chips and network and security management software and hardware. For more information, visit www.dustnetworks.com

About Linear Technology

Linear Technology Corporation, a member of the S&P 500, has been designing, manufacturing and marketing a broad line of high performance analog integrated circuits for major companies worldwide for three decades. The Company’s products provide an essential bridge between our analog world and the digital electronics in communications, networking, industrial, automotive, computer, medical, instrumentation, consumer, and military and aerospace systems. Linear Technology produces power management, data conversion, signal conditioning, RF and interface ICs, and µModule® subsystems. For more information, visit www.linear.com

LT, LTC, LTM, µModule and are registered trademarks of Linear Technology Corp. All other trademarks are the property of their respective owners.

Friday, December 9, 2011

Lattice Semiconductor to Acquire SiliconBlue


HILLSBORO, OR--(Marketwire - Dec 9, 2011) - Lattice Semiconductor Corporation (NASDAQLSCC) today announced it has entered into a definitive agreement to acquire SiliconBlue Technologies, a pioneer and leader in Custom Mobile Device™ solutions for the consumer handheld market. Utilizing a single chip, ultra-low power Field Programmable Gate Array (FPGA) fabric, SiliconBlue's mobileFPGA™ devices enable mobile designers to quickly add features to their mobile platform in areas such as connectivity, memory / storage, sensor management, and video / imaging. SiliconBlue's mobile FPGA devices have already shipped in the millions of units to top tier consumer OEM's.
Under terms of the agreement, Lattice Semiconductor will pay approximately $62 million in cash for SiliconBlue Technologies. The acquisition is subject to standard closing conditions, with a targeted close in the fourth quarter of 2011. Lattice Semiconductor ended the third quarter of 2011 with a cash, cash equivalents and short-term marketable securities balance of $267.2 million.
Darin G. Billerbeck, Lattice Semiconductor's President and Chief Executive Officer, said, "The acquisition of SiliconBlue is aligned with our Strategic Long Range Plan and will help accelerate our growth strategy in the Mobile Consumer market. Silicon Blue will further strengthen our product roadmap by adding a scalable, low cost, low power nonvolatile memory FPGA, along with key personnel and blue chip customers. Kapil Shankar, SiliconBlue's Chief Executive Officer, will join Lattice Semiconductor as Corporate Vice President of the Mobility Business Unit and will be responsible for the Company's mobility product lines."
The mobile consumer market for PLD's includes digital cameras, smartphones, eReaders, tablets, notebooks and netbooks. Key market growth trends include the drive for longer battery life, more natural interfaces, increased functionality, lower cost and reduced weight.
Mr. Shankar commented, "We are excited to be joining the Lattice Semiconductor family. Lattice gives us the global scale, proven market credibility and financial backing to take SiliconBlue to the next phase of its growth. We think our existing customers will immediately benefit from our new global reach and support. We also expect Lattice's added resources and financial strength will give potential new customers confidence in designing in our mobileFPGA solutions as we work to more fully realize the potential of our pioneering technology."
About SiliconBlue:Founded in 2006, privately held SiliconBlue Technologies is the leader in Custom Mobile Device (CMD) solutions, with over 250 active end customers and more than 40 patents. The company offers a total solution for handset applications, including IP, design services and a new class of ultra-low power, single-chip, CMOS SRAM mobileFPGA devices with patented non-volatile configuration memory (NVCM). The company is headquartered in Santa Clara, California, with offices in China, Taiwan, Korea and Japan. SiliconBlue is a privately held company and includes the following investors; BlueRunVentures, Crosslink Capital, NEA, Apex Venture Partners, TSMC and Atlantic Bridge. For more information, please visit our website atwww.siliconbluetech.com.
About Lattice Semiconductor: Lattice is the source for innovative FPGAPLD, programmable Power Management solutions. For more information, visit www.latticesemi.com. Follow Lattice via FacebookRSS and Twitter.

Monday, December 5, 2011

GainSpan Closes $18 Million Series C Financing


San Jose, CA – December 5, 2011 - GainSpan Corporation a leader in low power embedded Wi-Fi solutions, today announced that it has raised $18 million in Series C funding. Hatteras Funds, based in New York and North Carolina, and Mobile Internet Capital, based in Japan, joined in the round along with existing investors Opus Capital, In-Q-Tel, Intel Capital, New Venture Partners, Sigma Partners and Camp Ventures. GainSpan will use the new funds to further development of its next-generation ultra-low power Wi-Fi chip to support growth and maintain its technology leadership.
Over the past year GainSpan has experienced significant quarter to quarter growth in sales, design wins and overall market momentum, with Wi-Fi being accepted more and more as the technology of choice for the Internet of Things. Global demand for low power embedded Wi-Fi is being driven by device manufacturers looking to connect their devices to smartphones, to an existing Wi-Fi infrastructure or to the Internet. With its ultra-low power, highly comprehensive integrated networking stack and ease of use, the company's embedded Wi-Fi is the ideal solution for companies who want to connect all kinds of devices.
"GainSpan is clearly poised to capitalize on what has become a massive move to connect 'things' to the Internet," said Hideaki Yajima, executive director of Mobile Internet Capital, Inc. "Our investment reflects confidence that GainSpan is uniquely positioned in this space and is delivering a compelling technology to help make Wi-Fi the standard for Internet of Things connectivity."
"GainSpan continues to make great strides as an emerging leader in the low-power embedded Wi-Fi space," said Matt Lesesky, Hatteras Funds. "We think the company has the potential to help transform the practice of medicine by enabling remote health and wellness services on a wide scale. They are quickly expanding their footprint in this market and building a compelling business."
"The Internet of Things market is growing dramatically and taking off worldwide. Low power Wi-Fi is being used on more devices than ever before and GainSpan is at the heart of it," said Carl Showalter, general partner at Opus Capital, Inc. "Gainspan's leadership in supplying low power chips with high value software has been instrumental in helping accelerate this promising new market. We are excited to continue our support."
"Being able to attract such world-class companies is the ultimate seal of approval that we are in the right place at the right time with the right solution. While the debate over what wireless technology works best will continue, it's hard to argue with powerful financial backers, real customers and proven, innovative products in a hot market," said Greg Winner, President and CEO of GainSpan.
About GainSpan
GainSpan is a leading ultra-low power embedded Wi-Fi solutions company focused on connecting things wirelessly to the Internet. The company's Wi-Fi chips and modules make it possible to quickly and easily add Wi-Fi to devices, through a serial interface to a device microcontroller. The GainSpan Wi-Fi chip handles all Wi-Fi functionalities, networking and security stacks, accelerating wireless device development cycles. GainSpan solutions feature an ultra low power SoC that consumes just a few µA of standby current and has a few ms of wake-up latency, ideal for battery operated devices requiring long life. Applications for the company’s embedded Wi-Fi include healthcare, smart energy and control and monitoring for industrial, commercial and home markets. Based in San Jose, CA, the company has R&D facilities in Bangalore, India.www.gainspan.com

Wednesday, October 26, 2011

PMC-Sierra to acquire RAD3

Calgary, Alberta, October 25, 2011 – RAD3 Communications Inc. (RAD3), a Calgary-based communications intellectual property (IP) company, today announced that it has signed a definitive agreement to be acquired by PMC-Sierra, the semiconductor innovator transforming storage, optical and mobile networks. The team will continue to operate out of its Calgary office.

“We’re excited for our Calgary-based team to be joining an international company of PMC’s caliber,” Roger Bertschmann, president of RAD3. “PMC’s integration and silicon expertise, combined with our leading-edge capability in the design and delivery of communications and storage IP, will enable us to drive industry-changing technologies that transform the network.”

“RAD3’s technologies and highly experienced team are a good fit with PMC,” said Brian Gerson, PMC fellow and vice president of Research and Development. “RAD3’s Forward Error Correction (FEC) and Digital Signal Processing (DSP) technologies will enhance PMC’s ability to offer innovative, high-performance solutions for storage, optical and mobile networks.”

The acquisition is expected to close in November 2011, subject to customary closing conditions.

About RAD3 Communications
RAD3 is a leading supplier of communications intellectual property (IP) for new and emerging wired and wireless communication standards. RAD3’s extensive library of IP solutions enables communication companies to rapidly design and build their products using a suite of industry proven IP. For more information, please visit RAD3’s web site: www.rad3comm.com.

About PMC

PMC (Nasdaq:PMCS) is the semiconductor innovator transforming networks that connect, move and store digital content. Building on a track record of technology leadership, we are driving innovation across storage, optical and mobile networks. Our highly integrated solutions increase performance and enable next-generation services to accelerate the network transformation. For more information, visit www.pmc-sierra.com.

LSI to acquire SandForce

MILPITAS, Calif., October 26, 2011 – LSI Corporation (NYSE: LSI) today announced that it has signed a definitive agreement to acquire SandForce, Inc., the leading provider of flash storage processors for enterprise and client flash solutions and solid state drives (SSDs). Under the agreement, LSI will pay approximately $322 million in cash, net of cash assumed, and assume approximately $48 million of unvested stock options and restricted shares held by SandForce employees.

SandForce’s award-winning products include flash storage processors at the heart of PCIe flash adapters and SSDs. Flash storage processors provide the intelligence required to deliver the performance and low-latency benefits of flash storage in enterprise and client applications. With market-proven, differentiated DuraClass™ technology, SandForce flash storage processors improve the reliability, endurance and power efficiency of flash-based storage solutions.

The acquisition greatly enhances LSI's competitive position in the fast-growing server and storage PCIe flash adapter market, where the WarpDrive™ family of products from LSI already uses SandForce flash storage processors. The complementary combination of LSI’s custom capability and SandForce’s standard product offering propels LSI into an industry-leading position in the rapidly growing, high-volume flash storage processor market space for ultrabook, notebook and enterprise SSD and flash solutions.

“Flash-based solutions are critical for accelerating application performance in servers, storage and client devices,” said Abhi Talwalkar, LSI president and chief executive officer. “Adding SandForce’s technology to LSI’s broad storage portfolio is consistent with our mission to accelerate storage and networking. The acquisition represents a significant, rapidly growing market opportunity for LSI over the next several years.”

Michael Raam, SandForce president and CEO, said, “The combination of SandForce and LSI allows us to deliver differentiated solutions in the PCIe flash adapter segment by tightly integrating flash memory and management. In addition, leveraging our flash storage processors with LSI’s comprehensive IP portfolio and leading-edge silicon design platforms will lead to innovative solutions.”

The transaction is expected to close early in the first quarter of 2012 subject to customary closing conditions and regulatory approvals. Upon closing, the SandForce team will become part of LSI’s newly formed Flash Components Division, with Raam as general manager.

LSI expects the acquisition to be neutral to non-GAAP* earnings per share in 2012. The company will provide further details during its conference call at 2 p.m. PDT today and discuss third quarter results and the fourth quarter 2011 business outlook.

Tuesday, October 18, 2011

Sidense Raises Additional $5.6M

OTTAWA--(Marketwire - Oct 17, 2011) - Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) one-time programmable (OTP) memory IP cores, announced today that it has raised an additional $5.6 million for its Round C financing from several sources, including one new source, Ontario Emerging Technologies Fund (OETF). Also participating in this round of funding are existing Venture Capital investors including Tech Capital Partners, VentureLink, and Vertex Venture Capital.

"Sidense continues to perform very well in the market and has proven, patented technology of which we are very proud," said Andrew Abouchar, Sidense's Chairman of the Board. "We stand behind the company and its products, management and values. We are here to make sure that the company continues to be funded well so that it can execute according to plan."

"We are delighted to have the support of a new investor, alongside our existing investors," said Xerxes Wania, CEO and President of Sidense. "With the current financing, we are in an extremely good position to introduce our next generation of products in advanced process nodes."

About Sidense Corp.
Sidense Corp. provides secure, very dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes with no additional masks or process steps required and no impact on product yield. The Company's innovative one-transistor 1T-Fuse™ architecture provides the industry's smallest footprint, most reliable and lowest power Logic Non-Volatile Memory (LNVM) IP solution. With over 70 patents granted or pending, Sidense OTP provides a field-programmable alternative solution to Flash, mask ROM and eFuse in many OTP and MTP applications.

Sidense SiPROM, SLP and ULP memory products, embedded in over 160 customer designs, are available from 180nm down to 40nm and are scalable to 28nm and below. The IP is offered at and has been adopted by all top-tier semiconductor foundries and selected IDMs. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, WHDI, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, please visit www.sidense.com.

About the Ontario Emerging Technologies Fund (OETF)
The Ontario Emerging Technologies Fund is a $250 million direct investment fund, established in 2009 by the Province of Ontario and managed by the Ontario Capital Growth Corporation (OCGC), to co-invest into innovative, high-growth, private Ontario companies. www.ontario.ca/ocgc

Thursday, September 29, 2011

Atmel to Acquire ADD Semiconductor

SAN JOSE, Calif., Sept. 27, 2011 /PRNewswire/ -- Atmel® Corporation (Nasdaq: ATML) today announced that it has signed a definitive agreement to acquire Advanced Digital Design, S.A. ("ADD Semiconductor"), a privately held company based in Zaragoza, Spain that develops power line communication solutions. The transaction is subject to customary closing conditions and is expected to close in October. Atmel does not expect the acquisition to have a material impact on its overall financial position and results of operations in 2011.

ADD Semiconductor, a founding member of the PRIME Alliance, specializes in the design of system-on-chip solutions that allow for narrow-band data communication across existing electric power lines. In addition to successfully supporting a number of advanced meter infrastructure ("AMI") pilots in Europe, ADD Semiconductor products are also targeted towards the lighting, building automation and solar infrastructure markets.

With ADD Semiconductor, Atmel will acquire a portfolio of innovative products and a team of technical experts focused on signal processing and power line communications. This acquisition complements Atmel's existing smart energy product portfolio, better positioning the company for continued success in the growing smart meter, energy management, home and building automation markets.

Monday, September 26, 2011

Entropic invests $10M in Zenverge

SAN DIEGO, Sept. 26, 2011 (GLOBE NEWSWIRE) -- Entropic Communications, Inc. (Nasdaq:ENTR), a leading provider of silicon and software solutions to enable connected home entertainment and Zenverge, Inc., a leading developer of advanced media integrated circuits (ICs) for the connected home, today announced a strategic partnership to co-develop solutions and align product roadmaps for the delivery of content with powerful transcoding technology over a MoCA® 2.0 (Multimedia over Coax) home network. In addition, Entropic has made an investment in Zenverge totaling 10 million dollars (USD).

Service providers are seeking cost-effective ways to broaden delivery of video content beyond TVs, to portable display devices like tablets, smartphones, and laptops. Building on the partnership between the two companies announced earlier this year, a combined Entropic-Zenverge solution will enable service providers to leverage their investment in MoCA networks and the paradigm shift to IP content, to significantly expand the number and types of display devices on which their subscribers can consume content, while maintaining superior quality, security and market leading MoCA home network connectivity. With faster than real-time high definition (HD) transcoding from Zenverge and unsurpassed MoCA 2.0 performance from Entropic, pay-TV, over-the-top or personal video content can be streamed from a DVR, a network attached storage (NAS) device, or a personal computer (PC) and converted to a format most suitable for viewing on tablets, smartphones, or laptops. This content can either be watched immediately in a connected mode, or later from content stored locally.

The product roadmap alignment between the companies integrates the following features and attributes of each company to ensure a superb, seamless content viewing experience throughout the home and on any device:
  • Zenverge's Entertainment Nexus (ZEN) advanced architecture for HD media processing. This powerful architecture results in a high-performance, low-latency, lower power digital media processor capable of transcoding HD content up to four-times faster than real-time, and up to 30-times faster for lower-resolution content. In addition, the Zenverge media processor can simultaneously transcode up to four independent HD streams, or up to 16 independent standard definition (SD) streams, along with supporting full encode of HD content.
  • Entropic's MoCA 2.0 home networking silicon. Entropic brings proven speed and performance with its MoCA silicon and software. Enabling the most robust, predictable and powerful home networking backbone to reliably distribute bandwidth-intensive content throughout the home. With MoCA 1.1 already deployed as the de-facto connected home entertainment standard in the U.S., MoCA 2.0's higher throughput and backward interoperability is perfectly suited to intersect pay-TV provider next generation products and services.
"We're at a critical path in both our development and what the consumer market desires in their home entertainment interests," said Amir Mobini, chief executive officer, Zenverge. "By aligning our paths with Entropic, and maximizing the opportunity their MoCA 2.0 technology brings to the table, we will remain on target to deliver the most groundbreaking new architecture for digital HD convergence — that takes transcoding of digital media entertainment to unsurpassed levels of consumer and operator ease."

"This partnership crystallizes our connected home entertainment strategy and positions us to offer even greater value to our customers, our partners and ultimately the consumer," said Patrick Henry, president and chief executive officer, Entropic. "In addition to the clear strategic benefits of combining two highly complementary silicon products, we believe we can create substantial shareholder value by capitalizing on the consumer demand to have their video content delivered anywhere, anytime and to any device, in the home or on the go."

About Zenverge

Founded in 2005, Zenverge is a fabless semiconductor company devoted to accelerating consumer access to next generation digital content and services. The company is a leading developer of Advanced Media ICs built around the patented ZEN architecture, a core technology for next generation digital media devices. The company is based in Cupertino, California. For more information please visit the company website: www.zenverge.com.

About Entropic Communications

Entropic Communications, Inc. (Nasdaq:ENTR) is a leading fabless semiconductor company that is engineering the future of connected home networking and entertainment by providing next-generation silicon and software technologies to the world's leading cable, telco and satellite service providers, OEMs and consumer electronics manufacturers. As a co-founder of MoCA (Multimedia over Coax Alliance), Entropic pioneered and continues to evolve the way high-definition television-quality video and other multimedia and digital content such as movies, music, games and photos are brought into and delivered throughout the home. For more information, visit Entropicat www.entropic.com.

Quantance raises a $11M Series C

As reported by Dan Primak in his morning Term Sheet report: Quantance Inc., a San Mateo, Calif.-based maker of a power supply for 4G mobile devices, has raised $11 million in Series C funding. Backers include TD Fund, Granite Ventures, InterWest Partners and DoCoMo Capital. www.quantance.com

Thursday, September 15, 2011

GCT Files S-1 Initial Public Offering

The SEC S-1 and associated documents may be found here.

SAN JOSE, Calif.--(BUSINESS WIRE)--GCT® Semiconductor, Inc. (GCT) a leading fabless designer and supplier of advanced 4G mobile semiconductor solutions, today announced that it has filed a registration statement on Form S-1 with the U.S. Securities and Exchange Commission for a proposed initial public offering of its common stock. The number of shares to be offered and the price range for the offering have not yet been determined.

Goldman, Sachs & Co. and BofA Merrill Lynch are acting as book-running managers for the offering. Cowen and Company, LLC and Oppenheimer & Co, Inc. are acting as co-managers for the offering.

When available, a copy of the preliminary prospectus may be obtained from Goldman, Sachs & Co., Prospectus Department, 200 West Street, New York, NY 10282, telephone: 1-866-471-2526, facsimile: 212-902-9316 or by emailing prospectus-ny@ny.email.gs.com or from BofA Merrill Lynch, 4 World Financial Center, New York, NY 10080, Attn: Prospectus Department or by emailing dg.prospectus_requests@baml.com.

A registration statement relating to these securities has been filed with the Securities and Exchange Commission but has not yet become effective. These securities may not be sold nor may offers to buy be accepted prior to the time the registration statement becomes effective. This news release shall not constitute an offer to sell or the solicitation of an offer to buy, nor shall there be any sale of these securities in any state in which such an offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state.

About GCT Semiconductor, Inc.

GCT Semiconductor is a leading fabless designer and supplier of advanced 4G mobile solutions. GCT’s products are system-on-a-chip solutions that integrate radio frequency, baseband modem and digital signal processing functions onto a single die for the 4G LTE and WiMAX markets. GCT was the first to commercialize single-chip solutions for LTE and WiMAX and believes it is currently the only company selling fully-commercialized single-chip LTE solutions. GCT’s proprietary technology and system-level expertise enable us to provide complete 4G platform solutions, which are differentiated by their small form factors, low power consumption, high performance, high reliability and cost effectiveness.

Tuesday, September 6, 2011

Accent pivots business model to smart grid

Milan, Italy, September 6, 2011 - Accent, a world leading semiconductor supplier of communications and metering technologies, announced today its second-generation ASMgrid™ standard product family targeted at the demanding performance needs required by Smart Meters. ASMgrid2™incorporates optimized flexibility to support and track next-generation home-area-network (HAN) and near-area-network (NAN) communication standards including IEEE 802.15.4g, G3, PRIME, IEEE 1901.2, home area networking with IEEE 802.15.4. The ASSPs feature breakthrough system capability to address the demanding performance, cost, and scalability needs of Smart Grid equipment manufacturers.

While Smart Grid trials and deployments are in full force in many parts of the world, solution providers are still defining more advanced communication standards and product features which would be required in electric meters. Unfortunately, silicon solutions available today fall short in either providing support for newer technologies or doing so in a cost effective and scalable manner. The ASMgrid2 product family reconciles these competing forces through market leading silicon integration and technology innovation at the architectural and design level.

To provide complete advanced smart meter solutions, the ASMgrid2 system-on-chip architecture encompasses a broad range of technologies including high-precision analog-front-ends, RF transceivers, non-volatile memories, and processing capabilities needed to run required protocol stacks and vendor application software. Each one of the three devices in the ASMgrid2 product family contains an ARM® processor for unmatched performance, code density, and development capability. In addition to other processing, the ARM processors are also used in combination with hardware acceleration for Accent’s SUNFXTM modems, providing adaptable solutions for still evolving utility communication standards.

"We're delighted Accent is adopting Cortex-M and ARM9 series processors as key technology elements in what is certain to be a significant enabler for the smart grid industry," said Eric Schorn, VP Marketing, Processor Division, ARM. "The ARM architecture provides an ideal low-power processing solution to meet the sensitive performance and cost needs of smart meters that are expected to operate for periods up to 20 years on a single battery."

“The ASMgrid2 ASSP family represents industry-first solutions in terms of technology, integration and feature set specifically designed to optimally address advanced Smart Meters, by offering compelling solutions to equipment manufacturers seeking to support the latest and future meter communication technologies with built-in system scalability plus rich feature set to address their long product life cycles”, said Federico Arcelli, CEO of Accent.

ASM201 – SYSTEM-ON-CHIP FOR SMART HOME, COMMUNICATION, AND APPLICATION PROCESSING

To satisfy the increased processing and every expanding memory needs required in smart metering, Accent offers the ASM201. The device’s unprecedented integration replaces as many as five ICs for unparalleled system capability and significant cost reduction compared to alternative solutions. In addition to Accent’s AEMET™ energy measurement as well as IEEE 2.4 GHz radio solution, the ASM201 incorporates ample performance capability for a complete communication and application processing solution, for the home area and near area networking. Battery-mode operation is supported by microamp standby modes as well as ultra-low power RAM for quickest power-down with retained state information.

ASM211 – SYSTEM-ON-CHIP SUB-GHZ WIRELESS SOLUTION FOR ADVANCED RF MESH NETWORKS

For meter-to-meter wireless mesh networking, dominant in North America, Accent offers the ASM211 as a companion device for ASM201. The chip’s RF transceiver and software-based, hardware accelerated Accent SUNFX-4G modem is the industry’s first PHY solution to support the draft IEEE 802.15.4g standard’s mandatory FSK modes and high-data rate, OFDM options for up to 800 Kbps operation and a sensitivity of up to -118 dBm. The flexible architecture also offers support for existing FSK-based proprietary products.

ASM221 – SYSTEM-ON-CHIP FOR OFDM POWERLINE AND SMART METER PROCESSING

The ASM221 addresses next generation metering needs requiring advanced OFDM powerline communication including G3, PRIME, and IEEE1901.2. The ASM221 integrates Accent's SUNFX-PLC software based, hardware accelerated modem and analog front-end, Accent’s AEMET energy measurement as well as ample processing and non-volatile storage capability, enabling the industry’s first single-chip, scalable and future-proof meter solution. The ASM221 also incorporates advanced low-power features and retention RAM for battery-mode operation.

Availability

Product sampling for the ASMgrid2 ASSP family is expected to begin by Q4 2011.

About Accent

Founded in 1993, Accent (www.accent-soc.com) is an ISO 9001:2008 certified world leading semiconductor supplier of communications and metering technologies for the Smart Grid industry. The company is backed by renowned investors such as Sofinnova Partners and Tallwood Venture Capital. Accent is a worldwide operation with offices in Italy, China, France, and United States. Accent's ASMgrid product families integrate the widest technology breadth supporting current and future Smart Grid standards to provide equipment manufacturers off-the-shelf standard products plus complete software platforms for rapid time to market and significantly lowered production costs.

Monday, September 5, 2011

IDENT Technology AG closes 7.1M Euro round

Gilching, Germany, September 5, 2011. IDENT Technology AG, the leader in intelligent e-field based sensors for the consumer electronics industry, is pleased to welcome RBVC among its investors. Existing investors MIG Funds and Danube Equity also participated in the round.

“Our Z-Sense technology is all about making the user experience natural, intuitive, simple and fun”, said Dr. Roland Aubauer, Chief Technology Officer of IDENT and speaker of the board of IDENT. “With our proximity technology already in production we have decided to take our innovations further and launch our own GestIC chip for the fast growing three-dimensional gesture control market in 2012.”The GestIC, designed as a highly integrated system-on-chip (SoC), is aimed at the fast-growing 3D gesture control market. It addresses a broad range of consumer electronics devices, such as tablet computers or mobile phones. The company’s patented and proprietary e-field based technology allows real-time tracking of free space hand or finger movements in front of a device or display. The chip enables a broad range of signals from simple touch detection over sophisticated 3D gesture recognition to dynamic positional data of the user’s hand. This information is translated into any type of pre-processed user input commands. The technology advantages lie in its detection range, high resolution, robustness and very low power consumption.

Robert Bosch Venture Capital’s participation demonstrates its support of IDENT’s strategic vision. Dr. Dieter Kraft, Investment Partner for RBVC’s European Region, said: “We are impressed by IDENT’s technological and commercial achievements, and by the spirit and capabilities of the team. We are convinced that their solutions will make groundbreaking contributions to the user interface world and are happy to support their mission, also as an active member of the company’s supervisory board.”Michael Motschmann, Chief Executive Officer of IDENT’s main shareholder MIG Funds adds: ” RBVC is the venture arm of one of the world leading innovators. This investment is a proof of IDENT’s unique Intellectual Property. Having such a strong and experienced partner on board will enable IDENT to further achieve their technology’s full market potential.”

Christopher Kampshoff, Chief Financial Officer of IDENT concludes: “We are proud that we could engage RBVC for our goals and are looking forward to a business, financial and technical collaboration. With our global customers we are creating a new generation of mobile devices which the industry has not yet seen.”

About IDENT Technology AG

IDENT Technology AG is the industry’s leading provider of intellectual property and semiconductor products for electrical near field sensing solutions. The products enable intelligent proximity sensing and real-time 3D gesture control for the consumer electronics industry, including mobile devices, gaming and other input devices.

The company’s scalable and patented Z-Sense technology allows realization of disruptive human interface features, making products much smarter than previously possible and enabling natural intuitive use. IDENT Technology’s solutions combined with the EZApplication software suite containing a library of 1D touch to 3D gesture recognition solutions lets manufacturers quickly bring to market products which no longer require buttons or keys to switch a device on or off, to start applications, to point, click, zoom, scroll and more on any consumer electronics device.

For more information, visit www.ident-technology.com.

About Robert Bosch Venture Capital GmbH

The Bosch Group is a leading global supplier of technology and services. In the areas of automotive and industrial technology, consumer goods, and building technology, some 280,000 associates generated sales of more than 47 billion euro in fiscal 2010. Each year, Bosch spends more than 3.5 billion euros for research and development, and applies for over 3,000 patents worldwide. With all its products and services, Bosch enhances the quality of life by providing solutions which are both innovative and beneficial.

Robert Bosch Venture Capital GmbH invests worldwide in innovative start-up companies at all stages of their development. Its investment activities focus on technology companies working in areas of business of current and future relevance for Bosch, above all automation and control, energy and environment, enabling technologies, and healthcare. Robert Bosch Venture Capital GmbH also invests in services/ business models as well as new materials that are relevant to the above-mentioned areas of business.

For more information, visit www.bosch.com and www.rbvc.com

About MIG Verwaltungs AG

MIG Funds is a venture capital firm with an investment focus on early to mid stage life science and technology companies in German speaking Europe. MIG is the management entity of 11 venture capital funds (MIG Funds) exclusively distributed by AWAG.For more information, visit www.mig.ag

Thursday, August 4, 2011

Samsung Electronics Acquires Grandis, Inc.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced acquisition of Grandis Inc. (based in Silicon Valley, California), a leader in spin transfer torque random access memory (STT-RAM). Grandis will be merged into those Samsung's R&D operations that are focused on developing the next evolution of memory, where new semiconductor materials and structures are reviewed for their long- term commercial value. With its expertise in next-generation memory solutions and strong technical capabilities, Grandis will contribute to Samsung’s continued development of cutting-edge memory semiconductor technologies and become a key part of the company’s global R&D network.

Effective late July, the acquisition includes the full scope of technology, assets and human resources under Grandis, Inc. Further details of the transaction were not disclosed.

Wednesday, August 3, 2011

M/A-COM Files for IPO

SEC S-1 and associated documents may be found here.

LOWELL, MA, August 1, 2011 - M/A-COM Technology Solutions Holdings, Inc. (M/A-COM Tech) announced today that it has filed a registration statement on Form S-1 with the U.S. Securities and Exchange Commission (SEC) relating to a proposed initial public offering of its common stock. The number of shares to be offered and the price range for the offering have not yet been determined. A portion of the shares will be issued and sold by M/A-COM Tech and a portion will be sold by certain stockholders of M/A-COM Tech.

Barclays Capital Inc., J.P. Morgan Securities LLC and Jefferies & Company, Inc. will act as joint book-running managers. Morgan Keegan & Company, Inc., Needham & Company, LLC, Raymond James & Associates, Inc. and Stifel Nicolaus & Company, Incorporated will act as co-managers for the offering. The offering will be made only by means of a prospectus. A copy of the preliminary prospectus, when available, may be obtained from Barclays Capital Inc. at c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, New York 11717 or by email at barclaysprospectus@broadridge.com or by calling (888) 603-5847, or J.P. Morgan Securities LLC, Attention: Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, New York 11717, or by calling (866) 803-9204.

Friday, July 22, 2011

Spreadtrum to acquire Telegent

SHANGHAI, July 19, 2011 /PRNewswire-Asia-FirstCall/ -- Spreadtrum Communications, Inc. (NASDAQ: SPRD; "Spreadtrum" or the "Company"), a leading fabless semiconductor provider in China with advanced technology in both 2G and 3G wireless communications standards, today announced that it has signed a definitive agreement to purchase Telegent Systems, Inc. ("Telegent"), a provider of semiconductor and software solutions for the reception of live, broadcast television on mobile phones. Spreadtrum does not expect significant impact to either its cash position or operating expenses as a result of the transaction.

"Broadcast mobile TV is a popular feature with consumers in emerging markets, which is a target market segment for Spreadtrum and one in which we are experiencing rapid growth," said Dr. Leo Li, president and chief executive officer of Spreadtrum. "The acquisition of Telegent enhances the value proposition we can deliver to the supply chain serving this market segment from handset manufacturer to end market brand and accelerates our international footprint."

Telegent's technology portfolio delivers more than 70 patents granted or pending and a product line consisting of analog mobile TV ICs, hybrid analog/digital mobile TV ICs, mobile TV internal antenna technology, TV player software, and entertainment services software that enables the delivery of applications and advertising to handsets post-sale. Telegent's newly introduced product line, the TLG12xx series, introduces new innovations to the mobile TV market, including integrated internal antenna technology and a single-chip analog mobile TV receiver with the lowest power consumption and the lowest external bill of materials. Following the acquisition, Spreadtrum will explore integration opportunities with the baseband that deliver further performance and cost benefits.

In connection with the acquisition, approximately twenty hardware and software engineers from Telegent's Shanghai office will join Spreadtrum. The transaction has been approved by the Spreadtrum and Telegent boards of directors and is subject to customary closing conditions, including the approval of Telegent stockholders.

About Telegent Systems, Inc.

Telegent Systems is a fabless semiconductor company that enables the reception of live, free-to-air analog and digital broadcast television in mobile handsets and other portable consumer devices. Telegent's television-on-a-chip solutions solve the long-standing technical challenges that have precluded mobile reception of analog broadcast TV, enabling manufacturers and operators to benefit from the convergence of broadcast TV with mobile and portable devices. Telegent's products are the most widely sold broadcast television solutions for mobile handsets in the world. For more information, visit
www.telegent.com.

About Spreadtrum Communications, Inc.

Spreadtrum Communications, Inc. (Nasdaq: SPRD; 'Spreadtrum') is a fabless semiconductor company that develops baseband and RF processor solutions for the wireless communications market. Spreadtrum combines its semiconductor design expertise with its software development capabilities to deliver highly-integrated baseband processors with multimedia functionality and power management. Spreadtrum has developed its solutions based on an open development platform, enabling its customers to develop customized wireless products that are feature-rich to meet their cost and time-to-market requirements. For more information, please visit
www.spreadtrum.com.

Tuesday, July 19, 2011

Intel to Acquire Fulcrum Microsystems

SANTA CLARA, Calif.--(BUSINESS WIRE)--Intel Corporation today announced it signed a definitive agreement to acquire Fulcrum Microsystems Inc., a privately held fabless semiconductor company that designs Ethernet switch silicon for data center network providers.

“Intel is transforming from a leading server technology company to a comprehensive data center provider that offers computing, storage and networking building blocks,” said Kirk Skaugen, Intel vice president and general manager, Data Center Group. “Fulcrum Microsystems’ switch silicon, already recognized for high performance and low latency, complements Intel’s leading processors and Ethernet controllers, and will deliver our customers new levels of performance and energy efficiency while improving their economics of cloud service delivery.”

10 Gigabit Ethernet (10GbE) networks are one of the fastest-growing market segments in the data center today. As demand for data continues to increase, there is a growing need for high-performance, low-latency network switches to support evolving cloud architectures and the growth of converged networks in the enterprise. Fulcrum Microsystems designs integrated, standards-based 10GbE and 40 Gigabit Ethernet (40GbE) switch silicon that have low latency and workload balancing capabilities while helping provide superior network speeds.

Cloud computing is driving the convergence of server, storage and network technologies and solutions based around Intel® Xeon® processor solutions. IP Data Center customers need faster and more flexible networking solutions. The acquisition will fulfill an important component in Intel’s strategy to deliver comprehensive data center building blocks, from server processors and technologies to storage and networking.

“Customers in Web, financial services, technical and high-performance computing market segments appreciate the performance advantages Arista offers with our Extensible Operating System combined with switches based on Fulcrum Microsystems silicon,” said Andy Bechtolsheim, founder, chief development officer and chairman of Arista Networks. “Fulcrum Microsystems has architecture capabilities ideal for low-latency applications, and we are excited about the future possibilities of this technology as Fulcrum is acquired by Intel, the world’s largest semiconductor manufacturer.”

Founded in 1999, Fulcrum Microsystems is based in Calabasas, Calif. Additional terms of the transaction were not disclosed. The agreement is subject to the approval of Fulcrum Microsystems shareholders, regulatory approval and satisfaction of customary closing conditions. It is expected to close in the third quarter of 2011.

Monday, July 18, 2011

Maxim Acquires SensorDynamics

SUNNYVALE, CA– July 18, 2011 – Maxim Integrated Products (NASDAQ:MXIM) today announced it has acquired SensorDynamics, a privately held semiconductor company that develops proprietary sensor and microelectromechanical (MEMS) solutions. SensorDynamics is based in Lebring, near Graz, Austria.

SensorDynamics holds numerous original patents for MEMS sensor technology. It has devoted over 800 man‐years of research and development to the high‐growth fields of MEMS sensors and associated low power interface and wireless connectivity solutions. Consequently, this acquisition enables Maxim to accelerate expansion in markets where it already has a strong presence including automotive and high‐end consumer.

“Maxim is a recognized leader in analog integration, and this acquisition extends Maxim’s integration strategy by enabling us to fuse many types of sensors with our analog technology. The strategic integration of sensors, analog functions and low power wireless connectivity will allow us to deliver end‐to‐end mixed‐signal solutions that provide our customers with better performance, smaller form factors and lower system costs,” said Tunc Doluca, Maxim’s President and Chief Executive Officer. “The result will be a unique combination of technologies that will eventually enable a whole new generation of intelligent machines. We’re thrilled that SensorDynamics is joining us.”In the near term, this acquisition enables SensorDynamics to focus on its strength in engineering for sensors and MEMS, while utilizing Maxim’s considerable manufacturing, distribution and sales infrastructure. This will quickly make the combined company a leading competitor in the inertial sensor, wireless connectivity and sensor interface markets.

The MEMS‐based sensor market is expected to grow considerably as new applications for sensors are developed. According to market research firm IHS iSuppli, the total market for MEMS‐based sensors is expected to be $7.7 billion in 2011, of which SensorDynamics gyroscope inertial sensor technology addresses about $900 million. IHS iSuppli estimates this specific market will grow at a three‐year compound annual growth rate (CAGR) of 14 percent from 2011 to 2014. Longer term, Maxim will address selected portions of the broader MEMS‐based sensor market.

Sensors convert real‐world signals to analog signals and are a critical, adjacent function to analog semiconductors. They are a natural extension of Maxim’s strength in converting analog signals to digital signals and back to analog. SensorDynamics’ current focus on the automotive market aligns with Maxim’s goal to grow its automotive business. Maxim’s ability to extend SensorDynamics’ sensor technology to the high‐end consumer market is well suited to Maxim’s growth goals and track record of leveraging its own broad intellectual property portfolio to multiple markets.

Maxim is paying approximately $130 million plus the assumption of approximately $34 million in debt to acquire Sensor Dynamics.

About Maxim 

Maxim Integrated Products is a publicly traded company that designs, manufactures, and sells high‐performance semiconductor products. The company was founded over 25 years ago with the mission to deliver innovative analog and mixed‐signal engineering solutions that add value to its customersʹ products. To date, it has developed over 6400 products serving the industrial, communications, consumer, and computing markets.

About SensorDynamics

SensorDynamics is a semi‐fabless semiconductor company that focuses on innovative sensor solutions for high volume applications in automotive and high‐end consumer sectors. SensorDynamics develops and supplies fail‐safe micro and wireless semiconductor products for automotive and high‐end consumer key accounts and is certified under ISO/TS 16949. The company acts as a general contractor with in‐house MEMS production and cooperates closely with leading international technology partners. With its headquarters in Lebring near Graz, Austria, SensorDynamics has subsidiaries in Italy and Germany and a world‐wide sales network.

For more information on SensorDynamics and its products, please go to www.SensorDynamics.cc 

Thursday, July 7, 2011

Valens Semiconductor Closes $14 Million Investment B Round

HOD-HASHARON, Israel--(BUSINESS WIRE)--Valens Semiconductor, a leading provider of semiconductor products for the distribution of uncompressed high-definition (HD) multimedia content and the inventor of the HDBaseT™ technology, announced today that it has raised $14 million in its latest round of funding.

Valens’ successful traction with HDBaseT products in the marketplace contributed to the support from leaders in the global investment community. The Series B round of financing comes from a blend of new strategic partners, including Taiwan-based Pegatron and Japan-based Mitsui & Co. Global Investment Ltd., together with new venture capital fund investors, Amiti Ventures and Aviv Venture Capital. In addition, Genesis Partners and Magma Venture Partners, who participated in Series A round of financing, also contributed to Series B.

The funding will accelerate the development of follow-on generations of Valens’ HDBaseT chipset, enabling further integration, cost reduction and the facilitation of growth in multimedia transmission and data communication for consumer electronics and content provider industries. An impressive number of ProAV equipment manufacturers and consumer electronics companies are currently shipping and developing HDBaseT-enabled products including displays, projectors and A/V receivers.

Dror Jerushalmi, CEO and Co-Founder of Valens, stated “The quality of investors engaged in this round of financing speaks to the success of our HDBaseT technology and signals trust in our vision and our ability to further penetrate the CE market. These partnerships significantly enhance our ability to strengthen our foothold in the home-networking marketplace. We are ramping up production to deliver HDBaseT chipsets to global ODMs, OEMs and CE manufacturers along with added presence in the Japanese marketplace.”

Valens’ HDBaseT technology is a consumer electronic (CE) connectivity technology optimized for whole-home and commercial multimedia distribution. HDBaseT connects all entertainment devices, enabling a whole-home experience with the flexibility and features consumers demand. Using a single, long-reach LAN cable with RJ45 connectors already common in households for its Ethernet use, HDBaseT is fast becoming the global standard for advanced media distribution.


About Valens Semiconductor

Valens provides semiconductor products for the distribution of uncompressed high-definition (HD) multimedia content. The company's HDBaseT™ technology enables long-reach connectivity of devices over a single 100m/328ft standard CAT5e/6 LAN cable and is fast becoming the new, global standard for advanced digital media distribution. Valens is a founding member of the HDBaseT Alliance formed by leading CE companies to define a new industry standard for advanced digital media distribution. Founded in 2006, Valens is a private company with offices in Israel, Japan, Hong-Kong, USA and local representatives in Korea, Taiwan and China.

Wednesday, July 6, 2011

Microsemi Acquires ASIC Advantage, Inc.

IRVINE, Calif., July 6, 2011 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has acquired privately-held ASIC Advantage, Inc.

Known for its technical innovation with high levels of quality and reliability, ASIC Advantage is a fabless semiconductor company that designs and manufactures a broad portfolio of high-performance, high-voltage and radiation-hardened mixed-signal integrated circuit (IC) solutions for the aerospace, automotive, communications, industrial and medical markets. AsASIC Advantage's solutions are complementary to Microsemi's family of product offerings, the combined portfolio allows Microsemi to expand its reach into key markets and provide customers with a wider range of products from a single source.

"I am excited by this acquisition, which further solidifies our ability to serve industries demanding the highest standards of performance," stated James J. Peterson, Microsemi president and chief executive officer. "ASIC Advantage brings an entire portfolio of value-added IC designs targeting multiple core growth markets at Microsemi. While relatively small, this important acquisition offers strong synergy opportunities, enriches our mix and accelerates our growth potential."

Terms of the acquisition were not disclosed. Microsemi plans to discuss this acquisition as part of its third fiscal quarter conference call to be scheduled later in July.

About Microsemi

Microsemi Corporation (Nasdaq:MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and commercial; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, configurable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Irvine, Calif., and has more than 2,800 employees globally.Learn more at www.microsemi.com.

Tuesday, June 28, 2011

Fresco Microchip Raises $9 Million Series C Round

TORONTO, Canada, June 28, 2011 – Fresco Microchip Inc., a developer of leading-edge RF, mixed-signal and digital signal processing integrated circuits (ICs), today announced that it has secured funding in a series C financing round totaling $9 million. The Ontario Venture Capital Fund (OVCF) joins Fresco’s existing investors, which include Celtic House Venture Partners and Ventures West. Funds will be used to commercialize Fresco’s expanded product portfolio and to augment the company’s ability to serve customer demand in emerging markets.

With millions of chips shipped in hundreds of television models worldwide, Fresco is the de-facto standard for picture quality and optimal system cost in global television markets. The company’s field-proven TV demodulators enable sharper visual quality, richer brightness and more vivid colors, which enrich the overall viewing experience. Capitalizing on the company’s market leadership and vast engineering expertise in analog and digital television, Fresco has launched a family of silicon tuner products that reduce design complexity and system cost. Fresco’s silicon tuners leverage an innovative, game-changing architecture that eliminates redundant functionality and components commonly found in analog-only and hybrid televisions.

“Fresco’s success is a direct result of our ongoing commitment to deliver value through innovation,” said Lance Greggain, CEO, president, and co-founder of Fresco Microchip. “We are delighted to expand our investor syndicate with solid backing from Canada’s leading investment partners, which is a testament of our team’s technical know-how, deep market understanding and ability to deliver industry-leading products in high volume to our customers.”

“Fresco’s phenomenal growth in its first year of initial production demonstrates the distinct competitive advantage of the company’s technology,” said Brian Antonen, partner, Celtic House. “The addition of the OVCF to the investment syndicate will accelerate the company’s growth and paves the way for continued success with the launch of Fresco’s latest products.”

“Ventures West has been an investor in Fresco since its inception,” said Ted Anderson, managing general partner of Ventures West. “The company established itself as an industry leader with excellent brand recognition and quality, innovative products. We believe the company’s new products have tremendous potential to fundamentally change television technology.”

“OVCF is delighted to join our investment partners to support Fresco’s next stage of growth to deliver world class returns,” said Ian Carew, director of Northleaf Capital Partners, the manager of OVCF. “OVCF was designed to support innovative, emerging companies in Ontario, and Fresco is a great example of a high-potential firm that is well positioned to succeed on the global stage.”

About Celtic House Venture Partners 

For over 15 years, Celtic House Venture Partners has been Canada’s most active investor in private information and communications technology companies. Applying a unique architectural approach to investing and capitalizing on the deep domain expertise of its partners, Celtic House has consistently provided superior financial returns to its investors. With $315 million under management, Celtic House has collaborated with management teams and repeat entrepreneurs to develop platform technology companies from the inception phase through to exit, generating over 20 initial public offerings and successful acquisitions. For more information, visit www.celtic-house.com.

About Ventures West 

Ventures West is a privately held venture capital investment group that invests in early stage technology companies across Canada from offices in Vancouver and Toronto. Established in the Canadian venture capital market for 40 years, Ventures West has formed eight venture capital funds totaling over $700 million, and has invested in over 200 companies. With 5 professional technology investment managers, the Ventures West team has over 100 years of technology venture investing and hands-on operating experience. For more information, visit www.ventureswest.com.

About Ontario Venture Capital Fund 

The $205 million Ontario Venture Capital Fund is a joint initiative between the Government of Ontario and leading institutional investors to invest primarily in Ontario- based and Ontario-focused venture capital and growth equity funds that support innovative, high growth companies. OVCF is structured as a fund of funds to invest in a range of funds as well as co-investing directly in companies, with the primary objective of generating attractive returns for its investors. The Fund is managed by Northleaf Capital Partners. For more information on OVCF, go to www.ovcf.com.

About Fresco Microchip, Inc. 

Fresco Microchip is a leader in RF, analog and digital semiconductors. The company’s products deliver Value Through InnovationTM by offering significantly lower system solution costs at optimal performance. Fresco’s patent-pending technology transcends a broad range of consumer devices creating a fundamental paradigm shift in the television market. Fresco Microchip’s customers include top tier tuner manufacturers who supply leading consumer electronic brands. The company is headquartered in Markham, Canada with design centers in Ottawa, Canada and Irvine, Calif. For more information visit: www.frescomicrochip.com

Friday, June 24, 2011

Touchstone raises $12M Series A

MILPITAS, CA - June 23, 2011 – Touchstone Semiconductor, Inc., a developer of high-performance analog integrated circuit solutions, today announced that it has received $12 million in Series A funding. Silicon Valley venture capital firms Opus Capital and Khosla Ventures were the primary investors. Touchstone Semiconductor was the only semiconductor company in Silicon Valley to receive Series A funding in the year 2010. The investment is being used for research and development, marketing, and sales for Touchstone’s growing family of high-performance analog integrated circuits.

A group of industry experts from Maxim Integrated Products, Linear Technology and Analog Devices formed Touchstone in 2010 to build a high-performance analog company. Touchstone’s proprietary products offer a unique combination of features and performance that cannot be found elsewhere in the analog market. Touchstone’s second-source products are pin-compatible and specification identical to competitive offerings, providing an ideal alternative for hard-to-secure sole-sourced products.

“We are proud to be the only semiconductor company in the Silicon Valley to receive Series A funding last year. Our investors recognized that the highly fragmented $40 billion analog market offers a tremendous opportunity for sustained growth,” said Brett Fox, president and CEO of Touchstone Semiconductor. “We believe the combination of our extremely talented and committed team, industry expertise and proven business strategy will enable us to build a highly profitable company.”

“The ability to recruit top-notch analog engineering talent is extremely difficult,” commented Pierre Lamond, general partner at Khosla Ventures. “The Touchstone team has demonstrated its ability to hire an elite group.”

“The high-performance analog market is the most profitable and capital efficient segment of the semiconductor market. There are very few teams with the capability to successfully enter this market, and Touchstone is one of them,” said Gill Cogan, general partner at Opus Capital.

During the past three months, Touchstone has introduced its first products: the proprietary TS1001 Op Amp, the industry’s only operational amplifier that uses only 0.8V while using 0.6µA of current. Its TSM9117-9120 is a family of second-source comparators for Maxim Integrated Products’ popular MAX9117-MAX9120. At least 20 parts will be announced in its first year of production.

In other news, Touchstone announced that Cathal Phelan, chief technical officer at Cypress Semiconductor Corp. and a 25-year semiconductor industry expert, has joined its board of directors. He joins Fox, Cogan, and Naveed Sherwani, CEO, Open-Silicon.

ABOUT TOUCHSTONE

Touchstone Semiconductor Inc. (www.touchstonesemi.com) creates high-performance analog IC solutions that solve critical problems for electronics companies. Touchstone's second-source products are pin-compatible, specification identical solutions, offering customers a long-awaited alternative source for hard to get sole-sourced products. Touchstone's proprietary products provide unique combinations of features and performance that cannot be found from any other supplier. Founded in 2010, Touchstone is headquartered in Milpitas, Calif. Find us at Twitter:@touchstonesemi or Facebook: Touchstone Semiconductor.

Tuesday, June 21, 2011

DisplayLink Receives $8 Million Financing

PALO ALTO, Calif.--(BUSINESS WIRE)--DisplayLink, the leading provider of networked display technology for multi-monitor and USB-connected computing, has announced that it will receive eight million dollars of new financing in a fourth round investment, with an option for an additional six million if needed. The Palo Alto-based company did not disclose the investors providing the new capital. DisplayLink has previously received financing from Atlas Venture, Balderton Capital, DAG Ventures, DFJ Esprit and WTI. The company has raised a total of $68 million.

“DisplayLink has received another vote of confidence from the investor community with this new round of financing,” said Graham O’Keeffe, DisplayLink Chairman. “Strong growth continues in our markets for USB graphics adapters, universal docking stations, and monitors in both the corporate and consumer segments. There are now close to four million USB graphics users, with SuperSpeed USB 3.0 catching on quickly. This financing will help DisplayLink to rapidly deliver compelling new products for these markets.”

DisplayLink intends to continue its product development and innovation, particularly in the SuperSpeed USB and Wireless-enabled categories. According to a research report from In-Stat (www.in-stat.com) entitled “USB 2011: SuperSpeed Comes to Market,” nearly 80 million SuperSpeed-enabled devices will ship in 2011. DisplayLink has already been recognized as a leader in the SuperSpeed category, capturing a CES 2011 award for its enabling technologies.

“DisplayLink continues to benefit from the support of some of the world’s leading venture capital groups,” said Dennis Crespo, executive vice president of marketing and business development for DisplayLink. “With this investment, we are well-resourced to further grow our PC peripherals business, particularly in zero-client computing. This market has been fueled by the recent introduction of Windows Multipoint Server 2011, with DisplayLink supporting a growing number of customers and partners in this category.”

About DisplayLink

DisplayLink Corp develops hardware and software solutions to enable easy connectivity between computers and displays over standard interfaces such as USB, Ethernet and wireless networks. DisplayLink technology is used in dozens of globally branded PC accessories including monitors, universal docking stations, display adapters, projectors, and zero client systems that make expansion of the desktop visual workspace possible, at significantly lower cost and energy usage than traditional solutions.

Monday, June 20, 2011

ClariPhy secures new $14M funding round

IRVINE, Calif.--(BUSINESS WIRE)--ClariPhy Communications, Inc., a leading developer of ultra-high speed mixed signal, digital signal processing (MXSP) ICs for optical networks, announced today it has secured $14M in new financing. The funding round was led by Nokia Siemens Networks, a global supplier of telecommunications equipment and services, and also included existing investors. The investment strengthens ClariPhy’s capability to drive volume deployment of state of the art system on chips (SoCs) for coherent optical transmission at data rates of 40 gigabits per second (40G), 100G and beyond.

The widespread adoption of smart phones, surge in IPTV deployments and emerging cloud computing applications are driving capacity upgrades in optical transport networks worldwide. To meet growing bandwidth requirements in optical transport networks, ClariPhy is developing a new class of single-chip CMOS SoCs that uses advanced DSP driven coherent modulation schemes to increase reach and tolerance to impairments for optical networks while reducing cost of ownership. ClariPhy is the first semiconductor vendor to deliver SoCs targeting 40G coherent networks in 40nm CMOS, which provides a strong foundation for its SoC roadmap focused on further reduction in power consumption by leveraging 28nm and smaller geometries.

“We are pleased to announce this financing and to welcome Nokia Siemens Networks as an Investor,” said Paul Voois, CEO of ClariPhy. “Service providers are upgrading their networks to scale with ever-growing capacity requirements, driving optical networking OEMs to incorporate silicon solutions that deliver maximum performance and flexibility. Leveraging our extensive internal expertise in mixed signal design and scalable DSP architecture, our broad library of IP, and our backend integration capabilities, we are developing both standard and custom IC products that for the first time give all OEMs access to coherent transmission technology. The compelling economics of coherent transmission for service providers are the key driver for such strong industry participation in our recent financings.”

The new funding round, led by one of the industry’s largest network equipment suppliers, signals growing confidence in ClariPhy’s leadership and uniqueness in bringing together the requisite skills and technologies needed to develop the cost-effective CMOS networking ICs that will enable next generation optical networks. The investment from Nokia Siemens Networks also illustrates the growing synergy between its packet optical network plans and ClariPhy’s IC development strategy.

“Given the synergy between our two teams, we believe this relationship will enable us to offer highly differentiated and scalable products using ClariPhy’s Coherent IC and technology portfolio which gives us a clear competitive edge in the optical network markets,” said Vesa Tykkyläinen, head of optical networks at Nokia Siemens Networks.

All of ClariPhy’s existing venture investors participated in the funding round, including Norwest Venture Partners (NVP). “This investment continues to validate NVP’s long term backing of great technology teams that deliver disruptive solutions to the marketplace,” said Robert Abbott, General Partner at NVP. “We believe ClariPhy is the only Coherent SoC supplier that owns and develops all of the crucial mixed-signal and digital signal processing IP required to develop cutting-edge single chip CMOS solutions for coherent transmission at 40G and higher.”

About ClariPhy

ClariPhy Communications, Inc. (www.clariphy.com) develops mixed signal, advanced signal processing (MXSP) semiconductors targeting 10G, 40G and 100G networks in enterprise backbone, enterprise data center and telecom markets. ClariPhy is headquartered in Irvine, California and has offices in Los Altos, California and Cordoba, Argentina. ClariPhy’s investors include Allegis Capital, Norwest Venture Partners, Oclaro, Onset Ventures, Nokia Siemens Networks and Pacific General Ventures.

About Nokia Siemens Networks

Nokia Siemens Networks (www.nokiasiemensnetworks.com) is a leading global enabler of telecommunications services. With its focus on innovation and sustainability, the company provides a complete portfolio of mobile, fixed and converged network technology, as well as professional services including consultancy and systems integration, deployment, maintenance and managed services. It is one of the largest telecommunications hardware, software and professional services companies in the world. Operating in 150 countries, its headquarters are in Espoo, Finland.

About Norwest Venture Partners

Norwest Venture Partners (NVP) is a leading global investment firm that manages more than $3.7 billion in capital. Headquartered in Palo Alto, California, NVP has subsidiaries in Mumbai and Bengaluru, India and Herzelia, Israel. NVP makes early to late stage venture and growth equity investments in U.S. and global companies across a wide range of sectors including: information technology, business services, financial services, infrastructure, technology enabled services and consumer. NVP has actively partnered with entrepreneurs to build great businesses for more than 50 years and has funded nearly 500 companies since inception.

Monday, June 13, 2011

Analog Devices acquires Lyric Semiconductor

Norwood, MA (06/13/2011) - Analog Devices, Inc. (NYSE: ADI) today announced that it has acquired Lyric Semiconductor, a privately-held Cambridge, Massachusetts, company. Comprising a talented team of circuit design and algorithm experts, Lyric Semiconductor has developed an innovative set of techniques that have the potential to achieve an order of magnitude improvement in power efficiency in mixed-signal processing and enable additional signal processing functionality in a broad set of applications.

“As a leader in signal processing, ADI continually looks for opportunities to incubate ideas and invest in promising technologies for the future,” said Sam Fuller, ADI CTO and vice president of R&D. “Lyric’s domain knowledge, commitment to advancements in signal processing, and innovative spirit are a great fit for ADI and a strong addition to our long-term technology strategy.”

"Analog Devices and Lyric Semiconductor are extremely well aligned from a strategic perspective," said Ben Vigoda, Lyric co-founder and CEO. "We are excited about the commitment ADI is making to our team and technology and look forward to leveraging ADI's leadership and strengths to further innovate in the signal processing domain." The entire Lyric team, including co-founders Ben Vigoda and Dave Reynolds, are now ADI employees.

Analog Devices completed the acquisition of Lyric Semiconductor on June 9, 2011.