Tuesday, April 26, 2011

M/A-COM Acquires Optomai, Inc.

LOWELL, Mass.--(BUSINESS WIRE)--M/A-COM Technology Solutions (M/A-COM Tech) today announced that it has acquired privately-held Optomai, Inc. Optomai is a fabless semiconductor company that develops high performance integrated circuits and modules for next generation 40 Gbps and 100 Gbps fiber optic networks. Based in Silicon Valley, California, Optomai’s product portfolio and expertise in GaAs and InP circuit design complements M/A-COM Tech’s existing CATV/Broadcast and Point-to-Point/Infrastructure businesses, and accelerates its penetration of the rapidly growing optical communications market. Financial terms of the transaction were not disclosed.

"With user demand for data driving exponential bandwidth growth, it is paramount that our telecom and datacom customers achieve high performance with cost per bit efficiency," said Chuck Bland, Chief Executive Officer, M/A-COM Tech. "Optomai products are designed-in as innovative, compact, and cost-effective solutions that enable high-speed 40/100G networks, and the joined teams have the expertise to further expand our fiber optics business."

Optomai brings to M/A-COM Tech an accomplished team of business and engineering professionals with a proven track record in the optical communications industry. Optomai’s comprehensive product portfolio includes 40G and 100G modulator drivers and transimpedance amplifiers for both line side and client side applications.

“M/A-COM Tech offers the quality brand and reputation of a top tier IC solutions provider, and the sales channel and operational scale to make Optomai products pervasive in the marketplace,” said Vivek Rajgarhia, CEO of Optomai and now serving as General Manager of M/A-COM Tech’s Optoelectronics business unit. “Together we will deliver significant value to our combined customer base.”

About M/A-COM

M/A-COM Technology Solutions (www.macomtech.com) is a leading supplier of high performance semiconductors, active and passive components, and subassemblies for use in radio frequency (RF), microwave, and millimeter-wave applications. Recognized for its broad portfolio of products, M/A-COM Tech serves diverse markets, including CATV, wireless infrastructure, optical communications, aerospace and defense, automotive, industrial, medical, and mobile devices. M/A-COM Tech builds on 60 years of experience in designing and manufacturing innovative product solutions for customers worldwide.

Headquartered in Lowell, Massachusetts, M/A-COM Tech is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. M/A-COM Tech has design centers and sales offices throughout North America, Europe, Asia and Australia.

About Optomai

Optomai is a leading provider of high-speed optoelectronic ICs such as laser modulator drivers and transimpedance amplifiers (TIA). By leveraging its core competency in advanced high speed analog and microwave design, Optomai products resolve issues of power consumption, cost and size faced by 40 Gbps and 100 Gbps optical links.

Monday, April 25, 2011

Impinj files SEC S-1 for IPO

RFID company Impinj, Inc. has filed their first draft S-1 in preparation for an initial public stock offering.  For calendar year 2010, the company reports revenue of $31.8M and a $11.4M net loss.  For their last quarter, ending March 31st 2011, they reported revenues of $12.2M and a net loss of $1.8M.

Key customers:

  • "In 2010, Monza IC sales to Avery Dennison and UPM accounted for 42% and 29%, respectively, of our Monza IC revenue."
  • ".....our Indy reader ICs to reader OEMs and other customers, such as Trimble, Motorola and Coca-Cola. In 2010, sales to our top two Indy customers accounted for 34% and 17% % of our Indy reader IC revenue."
End users:
  • "The increase in product revenue for 2010 compared to 2009 was attributable to large deployments of our products by several retailers, including Walmart and Banana Republic. The increase in product revenue was partially offset by a decline in ASPs for each of our product lines."

The SEC filing may be found here.

Thursday, April 14, 2011

Fairchild acquires Swedish Company TranSiC

Answering the need for increasing efficiencies and higher performance for semiconductor applications, Fairchild Semiconductor (NYSE: FCS) is extending its technology leadership capabilities with the acquisition of TranSiC, a Silicon Carbide (SiC) power transistor company.

The acquisition provides Fairchild with bipolar SiC transistor technology with demonstrated industry leading efficiencies and excellent performance over wide temperature ranges, and superior performance over MOSFET and JFET technology approaches. Fairchild also acquired a team of highly experienced SiC engineers and scientists and multiple patents in SiC technology.

“The combination of silicon carbide technology with Fairchild’s existing capabilities in MOSFETs, IGBTs and multi-chip modules, along with our global access to customers, positions us to continue to be a leader in innovative, high performance power transistor technology,” said Mark Thompson, Fairchild’s Chairman, CEO and president.

“The performance levels achieved with SiC technology allow for much higher efficiency in power conversion. It also offers a higher switching speed, a feature that enables smaller end system form factors. Silicon Carbide technology is established in the market with a strong lead over alternatives in the wide bandgap area for applications that require voltages greater than 600V and demonstrates superior ruggedness and reliability,” added Dan Kinzer, Fairchild’s Chief Technology Officer.

These high gain SiC bipolar devices are ideal for high-power conversion applications in down-hole drilling, solar inverters, wind-powered inverters, electric and hybrid electric vehicles, industrial drives, UPS and light rail traction applications. These markets are projected by Yole Development to approach $1 billion by 2020.

This device is capable of industry leading efficiency, cutting losses relative to established silicon approaches by up to half, or allowing an increase of frequency by up to 4X with similar losses. Overall system cost and value can benefit from much smaller, lighter passive components. For systems that require the best efficiency and power density, there is no equal.

Fairchild is sampling initial 1200V products up to 50A ratings in targeted applications. Future offerings are in development to expand the voltage and current range, and to continue to drive improved energy saving.

About Fairchild Semiconductor:

Fairchild Semiconductor (NYSE: FCS) – global presence, local support, smart ideas. Fairchild delivers energy-efficient, easy-to-use and value-added semiconductor solutions for power and mobile designs. We help our customers differentiate their products and solve difficult technical challenges with our expertise in power and signal path products. Please contact us on the web at www.fairchildsemi.com.

Silicon Image to acquire SiBEAM

SUNNYVALE, Calif., April 14, 2011 – Silicon Image , Inc. (NASDAQ: SIMG), a leader in advanced, interoperable HD connectivity solutions for consumer electronics, today announced the signing of a definitive agreement to acquire privately-held SiBEAM, Inc. , a fabless semiconductor company headquartered in Sunnyvale, CA. SiBEAM is the leading provider of high-speed wireless communication products for uncompressed HD video in consumer electronics and personal computer applications, a founding member of the WirelessHD™ Consortium and an active member of the Wireless Gigabit Alliance (WiGig™).

The purchase price of the acquisition will be $25.5 million in cash and Silicon Image stock. The proposed transaction is expected to close in the second quarter of 2011. For 2011, the acquisition is anticipated to be dilutive to Silicon Image’s non-GAAP earnings by approximately $0.06 - $0.08 and neutral to earnings for 2012. The company intends to finalize its estimates of the transaction’s financial impact as well as the accounting for the transaction upon deal close.

“The acquisition of SiBEAM underscores our stated mission to be the leader in advanced video connectivity solutions and SiBEAM’s 60GHz wireless technology will enable us to rapidly bring the highest quality of wirelessly transmitted HD video and audio to market,” said Camillo Martino, chief executive officer of Silicon Image, Inc. “Silicon Image has a proven history of establishing successful global connectivity standards, including DVI®, HDMI®, and most recently MHL™ and we are looking forward to driving WirelessHD as a global connectivity standard and to delivering “standards plus” products supporting both wireless and wired HD connectivity standards.”

SiBEAM’s wireless technology has the ability to deliver true uncompressed, lossless high-definition digital video for a broad range of consumer electronics and personal computer applications. The company’s 60GHz Radio Frequency (RF) technology with multi-gigabit data rates offers the highest throughput of any mass market wireless solution available today and is compliant with both the WirelessHD and WiGig standards.

“Silicon Image's market leadership in developing and scaling consumer and PC solutions will help accelerate the growth of SiBEAM's 60GHz products,” said John LeMoncheck, president and chief executive officer at SiBEAM, Inc. "Increasingly, CE, PC, and mobile device manufacturers are looking towards 60GHz solutions for high-speed A/V and data connectivity. The combination of SiBEAM's wireless technology with Silicon Image's strength in HD connectivity solutions for mobile and consumer platforms makes this acquisition a natural fit for both companies.”

Consistent with its “standards plus” strategy, Silicon Image plans to continue to promote and actively engage with the WirelessHD Consortium and the WiGiG Alliance to further advance standards development for 60GHz wireless connectivity.

Until the deal closes, SiBEAM will continue independent operations.

Monday, April 11, 2011

Altair Semiconductor Raises $26 Million

Hod HaSharon, Israel – April 11, 2011 – Altair Semiconductor, the world's leading developer of ultra-low power, small footprint and high performance LTE chipsets, announced today that it has completed a $26 million round of funding, led by Jerusalem Venture Partners (JVP). All of Altair's existing investors, including BRM, Bessemer Venture Partners, Giza Venture Capital and Pacific Technology participated in the round.

Altair will use the capital to expand its worldwide sales and customer support activities as well as advance the development of its market-leading LTE solutions.

"As we rapidly expand our footprint in LTE markets around the world, this capital will allow us to continue to provide our customers with the support they need to deploy and commercialize our technology," said Oded Melamed, Co-Founder and CEO of Altair. "As the global LTE market is expected to grow exponentially over the next few years, the funding will help Altair expand our current market leadership position, as well as step up the production of our chipsets in response to the increasing demand from our customers."

Over the last year, Altair launched the first commercial LTE product in Poland, the world'sfirst Band 12 LTE solution and the first Digital Dividend LTE router in Germany. Having completed rigorous interoperability testing with numerous tier-one infrastructure vendors around the world, and with an LTE platform that is one of the world's only solutions that offers both TDD and FDD capabilities, Altair is poised to extend its market leadership position in several key markets around the world, including India, China, Japan, Europe and the United States.

"With its current global deployment and its chipsets now powering numerous mobile devices from tier-one manufacturers, Altair has established itself as the world's leading developer of LTE solutions," said Kobi Rozengarten, Managing Partner, JVP. "From the very beginning of our relationship with Altair, JVP fully believed that the combination of the Company's sound leadership and cutting-edge technology platform would translate into the commercial success that we are now beginning to witness."

About Altair Semiconductor 

Altair Semiconductor is the world's leading developer of ultra-low power, small footprint and high performance 4G semiconductors. The company's products provide device manufacturers integrating 4G LTE technology into their products with a highly power-optimized, robust and cost-effective solution. Altair’s comprehensive product portfolio includes baseband processors, multi-band RF transceivers for both FDD and TDD bands, and a range of reference hardware and product level protocol stack software. Based on a novel, proprietary Software Defined Radio (SDR) processor, codenamed “O2P™”, Altair’s products are the smallest and most highly power optimized in the industry, offering an unmatched combination of flexibility and performance. For more information, visit the company's website at www.altair-semi.com. Follow Altair on Twitter: @AltairSemi

Friday, April 8, 2011

Sequans Communications announces IPO terms

Sequans Communications S.A., a fabless supplier of 4G semiconductor solutions for wireless broadband applications, announced terms for its IPO on Monday. The company plans to raise $110 million by offering 9.2 million ADSs at a price range of $11 to $13. At the mid-point of the proposed range, Sequans Communications S.A. will command a market value of $438 million. Sequans Communications S.A., which was founded in 2003 and booked $69 million in sales last year, plans to list on the NYSE under the symbol SQNS. UBS Investment Bank and Jefferies & Co. are the lead underwriters on the deal, which is expected to price during the week of April 11.

Source: Renaissance Capital, Greenwich, CT (www.renaissancecapital.com).

Thursday, April 7, 2011

Gennum Acquires Nanotech Semiconductor

Burlington, Ontario and Bristol, United Kingdom – April 6, 2011 – Gennum Corporation (TSX: GND) announced today it has acquired Nanotech Semiconductor Limited, a leading fabless IC company specializing in advanced CMOS mixed-signal ICs for fiber optic communications. This acquisition, pursuant to which Gennum paid USD$34 million in cash and agreed to an earn-out as described below, further strengthens Gennum's growth strategy in the optical transceiver IC market by adding state-of-the-art CMOS products and technology for high volume applications such as Ethernet, PON, telecom and consumer optics.

The transaction is expected to result in a number of benefits, including the following:
  • Increased market presence in an expanded, US$1.3 billion addressable market
  • A strongly positioned business with a highly differentiated optical transceiver IC portfolio, spanning the entire optical speed range from 100Mb/s to 100Gb/s
  • Strengthened optical transceiver IC market position for telecom, Ethernet, PON and consumer optics applications
  • State of the art CMOS technology to deliver groundbreaking low cost optical IC products
  • Addresses customers' need to consolidate the supply chain and provide a convenient one-stop-shop for optical transceiver ICs at all data rates
  • Increased revenues, with Nanotech's revenues for the year ended December 31, 2010 being approximately US$7.4 million and current revenues being approximately US$1.0 million per month

"Through this acquisition, Gennum has significantly strengthened our mixed-signal and optical product portfolio and added critical CMOS technology capability enabling our company to address a broader range of high growth networking markets such as Fiber to the Home, Ethernet and consumer optics," said Dr. Franz Fink, President and Chief Executive Officer of Gennum. "We have listened to our customers' needs to simplify the supply chain and can now provide them with one of the most complete optical transceiver ICs portfolios spanning all data rates. Indeed, we believe the Nanotech portfolio coupled with Gennum's high speed mixed signal and optical portfolio will increase our ability to provide more, high value products resulting in increased growth opportunities for Gennum."

"We are excited to join Gennum and create one of the industry's most compelling optical IC transceiver portfolios," said Gary Steele, Founder, CEO and Chairman of the Board of Nanotech. "By integrating our recognized expertise in low cost, high performance CMOS based optical products and technologies and talented employees with Gennum's high speed optical products and global organization, customers will gain access to a uniquely comprehensive portfolio and product roadmap."

Expansion of Optical Transceiver Portfolio to Accelerate Growth Strategy

Gennum expects the combined portfolio will deliver highly differentiated optical products that capture a greater portion of the silicon content in applications such as telecommunications, networking, fiber to the home, and consumer connectivity.

The Nanotech portfolio includes industry-leading CMOS based optical ICs. These products span the following optical markets:
  • OC-3, OC-12, Gigabit Ethernet based telecommunications applications
  • GEPON, GPON for fiber to the home applications
  • Fast Ethernet, Gigabit Ethernet based networking applications
  • Firewire, Fast Ethernet, Gigabit Ethernet, HDMI for consumer applications
Transaction Summary Under the transaction, Gennum acquired all of the outstanding shares of Nanotech at a purchase price of US$34 million plus an amount of up to US$6 million payable under an earn-out for the achievement by Nanotech of revenue targets over the next 12 months between US$10 million and US$14 million. Based on information provided by Nanotech, Gennum expects that the transaction will be accretive on a non-GAAP* basis and approximately neutral to its GAAP earnings in the fiscal year ending November 30, 2011. Gennum expects the transaction to be accretive to its GAAP earnings in fiscal 2012.
About Gennum

Gennum Corporation (TSX: GND) designs innovative semiconductor solutions and intellectual property (IP) cores to serve the rising global demand for high-speed data transmission products in the broadcast, networking, storage and telecommunications markets. Gennum offers proven optical, analog and mixed-signal solutions with uncompromising signal integrity to support standards such as high-definition (HD) video, Fibre Channel, InfiniBand®, Ethernet, SONET and PCI Express®. The company is headquartered in Burlington, Canada, and has global design, research and development and sales offices in Canada, Mexico, Japan, Germany, United States, India and the United Kingdom.
About Nanotech

Based in the United Kingdom, Nanotech is a fabless chip company, focused on analog and mixed-signal ICs principally for fiber-optics based communications.