SANTA CLARA, Calif.--(BUSINESS WIRE)--Ambarella, Inc., a leading developer of semiconductor processing solutions for video that enable high-definition video capture, sharing and display, today announced that it has filed a registration statement on Form S-1 with the Securities and Exchange Commission for a proposed initial public offering of its ordinary shares. The number of shares to be offered and the price range for the offering have not yet been determined.
Morgan Stanley & Co. LLC and Deutsche Bank Securities Inc. are acting as the joint book-running managers for the offering. Stifel, Nicolaus & Company, Incorporated and Needham & Company, LLC are acting as co-managers for the offering.
When available, a copy of the preliminary prospectus may be obtained from Morgan Stanley & Co. LLC, by telephone: (866) 718-1649; by standard mail at Morgan Stanley & Co. LLC, Attention: Prospectus Department, 180 Varick Street, New York, NY 10014; or by email: firstname.lastname@example.org; and from Deutsche Bank Securities Inc., by mail at Deutsche Bank Securities Inc., Attention: Prospectus Department, Harborside Financial Center, 100 Plaza One, Jersey City, NJ 07311-3988; by telephone: (800) 503-4611; or by e-mailing email@example.com.
Link to the S-1 filing here.
End customers: In the camera market, our video processing solutions are designed into products from leading OEMs including Eastman Kodak Company, GoPro, Samsung Electronics Co., Ltd. and Sony Corporation, who source our solutions from ODMs including Ability Enterprise Co., Ltd., Asia Optical Co. Inc., Chicony Electronics Co., Ltd., DXG Technology Corp., Hon Hai Precision Industry Co., Ltd. and Sky Light Digital Ltd. In the infrastructure market, our solutions are designed into products from leading OEMs including Harmonic Inc., Motorola Mobility, Inc. and Telefonaktiebolaget LM Ericsson, who source our solutions from leading ODMs such as Plexus Corp.
Financial Highlights: For fiscal year ending 1/31/2011; sales of $94.7M and a GM of 64%.
Manufacturing: "To date, the majority of our SoCs have been manufactured on a turnkey basis by Global UniChip Corporation, or GUC, in Taiwan, from whom we purchase fully assembled and tested products. The wafers used by GUC in the assembly of our products are manufactured by Taiwan Semiconductor Manufacturing Co., Ltd., or TSMC, in Taiwan. Beginning in fiscal year 2010, we began to use Samsung Electronics Co., Ltd., or Samsung, in South Korea, from whom we have the option to purchase both fully assembled and tested products as well as raw wafers. GUC subcontracts the assembly of the products it supplies to us to Advanced Semiconductor Engineering, Inc. and Siliconware Precision Industries Co., Ltd. Samsung subcontracts the assembly and initial testing of the products it supplies to us to Signetics Corporation and STATS ChipPAC Ltd. Final testing of all of our products is handled by King Yuan Electronics Co., Ltd. or Sigurd Corporation under the supervision of our engineers."
Patents: As of March 31, 2011, we had 11 issued and allowed patents in the United States, three issued patents in China, and 46 pending and provisional patent applications in the United States.